For analog and mixed signal device production, GSI Group WaferTrim™ laser systems are the industry leader in laser trimming of resistors at the wafer level. Our applications cover power management, data conversion, ......For analog and mixed signal device production, GSI Group WaferTrim™ laser systems are the industry leader in laser trimming of resistors at the wafer level. Our applications cover power management, data conversion, sensors, RF, and precision analog devices used in the rapidly growing mobile communications market. With active laser trimming, you optimize final device performance and die yield in real time on the test floor. You eliminate total dependence on the fab manufacturing processes. Our WaferTrim systems provide you with a strategic customization advantage. By integrating both fuse links and thin film resistors in one standard mask set, you create the flexibility to generate multiple products from the same wafer, and control final performance. Only through wafer level trimming will you optimize analog circuit performance, routinely achieving resistor tolerances of less than 0.01%.