Palomar Technologies is headquartered in Carlsbad, CA, with three national sales offices that service North, South, and Central America. Our headquarters is our primary engineering, production, and manufacturing facility.......Palomar Technologies is headquartered in Carlsbad, CA, with three national sales offices that service North, South, and Central America. Our headquarters is our primary engineering, production, and manufacturing facility. From our office in Erlangen, Germany and Singapore, we provide sales, service and applications demonstration support for our European and Asian customers. Some Background History Palomar Technologies was originally established in the 1970s within the Assembly and Test Products product line of Hughes Aircraft Industrial Products Division (IPD) (which became known as the Technology Products Division (TPD) in the early 1990s). As the Automatic Microcircuit Bonder group, we primarily served Hughes’ military and aerospace customers by developing industrial electronics. Our major accomplishments during this period include: Early 1980s—debut of the Model 2470-I Wedge Bonder, the most innovative product of its kind on the market and a key to the defense industry the Model 2470-V Wedge Bonder debuted in 1995 Late 1980s—leading the way for the development of supercomputers Early 1990s—leading the way for die attach technology with the debut of the Model 3500-I Automatic Component Placement Cell the development of integrated production lines and the debut of the Model 3470-I Wedge Bonder We developed many patents during our years as the Automatic Microcircuit Bonder group, 19 of which were transferred to our ownership as Palomar Technologies, including: Ball Formation on Gold Wire Missing Wire Detector Bond Signature Analyzer Orthogonal Bonding Measuring Electrical Interconnect Integrity In the late 1990s we were well positioned to take advantage of the telecom boom and have always maintained a diversified mix of products and customers, all with the common thread of precision automated packaging.