We are a global business employing over 750 people in Europe and North America. Our people are our biggest asset and we’re pleased to have many of the very best in the industry. We offer our customers specialist skills i......We are a global business employing over 750 people in Europe and North America. Our people are our biggest asset and we’re pleased to have many of the very best in the industry. We offer our customers specialist skills in semiconductor and system design, product development and high-quality electronics manufacturing, as well as test and quality assurance. Our products are typically found in: High-frequency systems High-current systems Safety critical applications Systems required to function reliably under conditions of extreme temperature, humidity, vibration and/or shock Applications requiring supplier accreditations such as ISO TS 16949, ISO 13485 and QC001002-3. We’re proud to be called a trusted partner by many of the world’s leading companies, and frequently open our facilities up for customer inspection and audit. Our company culture is all about performing to high quality standards and delivering to promise. Whatever we’ve achieved in the past, we always aim higher next time. We offer customers a complete high-precision microelectronics manufacturing capability ranging from prototype design and simulation through to manufacture and test of finished product. We are able to provide solutions to the most demanding customer requirements through a broad range of technologies, and skills including: expert know-how relating to the design for manufacture of very high frequency electronics, expertise in thermal management in complex electronic designs and leading technology for advanced electronic interconnection. This expertise enables C-MAC to offer a range of solutions in such application areas as RF & Microwave modules, high power LED arrays, complex system in package and multichip semiconductor packaging. At its locations C-MAC has invested in a wide technology footprint, which includes: Chip & Wire, Flip Chip, Chip Testing, Thick Film Hybrid assembly and LTCC (Low Temperature Co-Fired Ceramics). These technologies are particularly relevant in high reliability applications, for example in the Automotive industry where there is an increased distribution of electronics sensors throughout vehicles. This results in electronics having to operate at high temperature and extremes of vibration. C-MAC has been involved for a number of years designing and manufacturing electronic systems, packaging MEMS sensors and other semiconductors for these kind of demanding applications, where long term reliability is a prerequisite. C-MAC also has a strong presence in the Aerospace market where high frequency applications, such as Radar, place extreme demands on signal integrity and often mean that thick film hybrid solutions on ceramic substrates are the preferred choice over conventional pcb. C-MAC MicroTechnology has many years of experience in this sector and can count involvement in programmes such as Typhoon Eurofighter amongst its achievements. All of us at C-MAC MicroTechnology are ready and willing to help any customer with their high-reliability electronics requirements.