en.Wedoany.com Reported - On April 3, 2026, CEA-Leti, CEA-List, and Powerchip announced a strategic collaboration. This partnership will integrate CEA-List's RISC-V design expertise and CEA-Leti's silicon photonics technology into Powerchip's 3D stacking and interposer platform to provide high-bandwidth communication and high-efficiency computing solutions for next-generation AI systems. According to a CEA-Leti press release, the collaboration directly addresses challenges faced by the semiconductor industry, including the physical limits of copper interconnects, tight power budgets, and the need for scalable computing architectures.

According to Olivier Thomas, Deputy Director of the Digital Integrated Circuit Design Division at CEA-List, RISC-V is transforming processor design through openness, flexibility, and cost-effectiveness. Its customizable architecture allows industrial players to develop solutions tailored to their own needs. This collaboration will provide customers with customizable computing platforms to meet performance and power consumption targets. CEA-Leti CEO Sébastien Dauvé added that MicroLED is a key enabling technology, and they will leverage low-power GaN LED solutions to enhance optical communication throughput. Dr. Shou-Cheng Chang, Chief Technology Officer of Powerchip, stated that the collaboration enriches Powerchip's portfolio of 3D stacking and interposer technologies with high-efficiency RISC-V computing IP and high-bandwidth silicon photonics chip communication. By combining the expertise of all three parties, it aims to provide foundry services for next-generation AI applications.

Founded in 1967, CEA-Leti is a global leader in miniaturization technologies, boasting over 2,000 talents, a portfolio of 3,200 patents, 14,000 square meters of cleanroom space, and having incubated 80 startups. CEA-List specializes in intelligent digital systems, with 1,000 researchers located in Paris-Saclay and Grenoble. Powerchip is a leading pure-play semiconductor foundry globally. It has established an "Open Foundry" model and focuses on integrated circuit manufacturing for consumer electronics, the Internet of Things (IoT), electric vehicles, and AI.

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