en.Wedoany.com Reported - AEIM Pte Ltd, a wholly owned subsidiary of Polymatech Electronics Limited, announced the official launch of its advanced electronics manufacturing facility at 163 Kallang Way, Mapletree Hi-Tech Park, Singapore. The facility, backed by a committed investment of approximately $25 million (about S$32 million), will serve as Polymatech's Asia-Pacific manufacturing hub for Chip-on-Board (CoB) LED packaging and is equipped with advanced memory module assembly capabilities.
Positioned as one of Singapore's first dedicated commercial-scale Chip-on-Board (CoB) LED packaging facilities, it is expected to create approximately 50 high-value engineering and manufacturing jobs in Singapore over the next five years. The official launch ceremony was attended by representatives from the Singapore Economic Development Board (EDB), as well as technology and industry partners from Japan, Malaysia, France, the United States, and Singapore, along with members of Singapore's semiconductor and advanced manufacturing ecosystem.
The AEIM facility at Kallang Way is now fully operational, equipped with advanced dispensing, encapsulation, curing, inspection, testing, and module assembly systems to support high-precision electronics manufacturing and specialized Chip-on-Board (CoB) LED packaging applications. The facility houses two complementary manufacturing capabilities: a Chip-on-Board (CoB) LED packaging line producing UV, IR, and full-spectrum LED CoB products for horticulture, medical, industrial inspection, and specialized OEM applications; and an advanced memory module assembly capability supporting high-performance computing, enterprise systems, industrial electronics, and embedded technology applications.
Mr. Eswara Rao Nandam, Managing Director of AEIM Pte Ltd, stated that the launch of the Singapore facility marks a milestone in Polymatech's journey from an Indian semiconductor and advanced electronics manufacturer to a globally integrated enterprise. The facility serves as the Asia-Pacific fulcrum of a supply chain spanning five countries and four continents, covering operations from sapphire crystal growth in France to advanced packaging in Singapore. Mr. Ng Ming Liang, Vice President of Global Enterprises at the Singapore Economic Development Board (EDB), noted that Polymatech's new Singapore facility is a testament to Singapore's robust semiconductor ecosystem, with a skilled talent pool and well-connected supply chain infrastructure.
AEIM Pte Ltd has committed and deployed approximately $25 million for the construction and operation of the facility. The facility is currently recruiting engineering, manufacturing, quality, and technical professionals, and plans to establish a talent pipeline through collaborations with local universities and institutions to support the development of local advanced manufacturing capabilities.
Polymatech's international operations now span five countries across four continents: AEIM SARL in France (producing sapphire ingots and wafers in partnership with the ECM Group), Polymatech Electronics Limited in India (advanced semiconductor packaging and electronics manufacturing), AEIM Pte Ltd in Singapore (LED CoB packaging and advanced memory module assembly), Brandner Electronics OÜ in Estonia (semiconductor substrates and advanced printed circuit board manufacturing), and Nisene Technology Group in the United States (semiconductor testing, failure analysis, and reliability engineering equipment).
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