en.Wedoany.com Reported - Hanmi Semiconductor launched a new equipment, "FC Bonder 3.5 (Flip Chip Bonder 3.5)," on the 26th for the 2.5D packaging process of AI semiconductors, and began supplying it to global foundries and OSAT companies.

This equipment is an aggressive product targeting the AI system chip packaging market. Hanmi Semiconductor plans to expand its business scope into system chip packaging based on the technology accumulated in the TC Bonder market for High Bandwidth Memory (HBM).

The FC Bonder 3.5 can handle large panels and substrates up to 340 mm in size, supporting ultra-large chip and multi-chip integration processes. In addition to flip chip bonding, it also supports face-up bonding using Die Attach Film (DAF), enabling adaptation to different customer process conditions.

Hanmi Semiconductor plans to establish a U.S. subsidiary, "Hanmi USA," by the end of this year to strengthen local sales and customer support. Following the TC Bonder for HBM, the company will expand the supply of AI system chip packaging equipment to broaden its global customer base.

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