en.Wedoany.com Reported - On June 26, the second-phase 12-inch large silicon wafer production line of Zhengzhou Hejing Silicon Materials Co., Ltd. was launched in the Zhengzhou Airport Economy Zone, with a project investment exceeding 3 billion yuan, directly filling the gap in large-size high-end semiconductor silicon wafer production capacity in Henan Province. Once operational, the production line can supply nearby wafer fabs in the airport zone and the central region, shortening material transportation cycles and reducing raw material procurement costs for regional semiconductor enterprises.
The project covers an area of 65 mu (approximately 4.33 hectares), with a total building area of 80,000 square meters. Its core business focuses on the R&D and mass production of 12-inch monocrystalline silicon polished wafers and epitaxial wafers, enhancing the supporting capacity of the upstream key material supply chain for semiconductors in the central region and accelerating the formation of a central semiconductor industry cluster.
12-inch large silicon wafers have higher technical barriers compared to traditional 8-inch wafers and serve as the core substrate material for mainstream semiconductor devices such as high-end logic chips and image sensors. With the rising demand for AI computing chips, advanced process logic chips, and automotive image sensors, the supply gap for 12-inch polished and epitaxial wafers is widening. The project's production can meet the upstream material procurement needs of domestic wafer fabs.
Previously, China's 12-inch high-end silicon wafers have long relied on supply from outside the province or even overseas, with the central region lacking large-scale local production capacity. After the completion and operation of the second-phase project of Zhengzhou Hejing, it can serve regional wafer manufacturing enterprises nearby, addressing the shortcomings in the supply chain supporting infrastructure.
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