Seika Machinery, Inc. to Host Webinar on PCB Singulation Methods

en.Wedoany.com Reported - Seika Machinery, Inc. will host the second session of its SMI 2026 Summer Webinar Series on July 8 at 10:00 AM PDT, focusing on how PCB singulation methods impact board quality, component reliability, and overall manufacturing consistency.

Titled "PCB Singulation Methods: Stress, Edge Quality, and Process Performance Comparison," this session will provide a practical examination of how different separation techniques affect mechanical stress and finished board quality, as well as the importance of these differences in actual production. The webinar will cover common board separation methods such as manual snapping, pliers, guillotine cutters, and standard PCB routers, comparing the advantages and limitations of each approach while presenting strain gauge data to reveal stress variations introduced during manual separation. Additionally, the session will review real-world cases of edge damage and component-related defects, illustrating the issues that can arise when boards are separated without a controlled process.

Part of the session will introduce the Sayaka PCB routing system, covering manual, semi-automatic, and fully automatic platforms. The presenter will discuss how low-stress, controlled separation helps protect components, improve edge quality, and achieve more repeatable results across different production environments. For manufacturers evaluating alternatives to manual board separation or seeking to increase throughput through automation, this session aims to provide guidance on selecting the right method based on board design, volume, and reliability requirements.

The webinar is free but requires advance registration. It will take place on Wednesday, July 8, 2026, at 10:00 AM PDT.