en.Wedoany.com Reported - LG Chem Ltd. (Seoul, South Korea) has begun mass-producing and supplying semiconductor strippers to Amkor Technology, Inc. (Tempe, Arizona, USA), marking its first entry into the semiconductor stripper market, a move that will accelerate the implementation of its semiconductor materials business expansion strategy.
Amkor Technology is a global leader in the outsourced semiconductor assembly and test (OSAT) sector, providing packaging and testing services to the world's leading semiconductor manufacturers. A semiconductor stripper is a critical process material used to remove photoresist (PR) and residues remaining on semiconductor substrates after circuit patterning. As semiconductor circuits continue to shrink, the performance of residue removal directly impacts manufacturing yield and product reliability, making stripper performance a key factor in determining semiconductor quality.
LG Chem entered the semiconductor stripper market by leveraging the technical expertise and customer support capabilities accumulated in its display stripper business. The company successfully passed Amkor Technology's rigorous certification process with its first semiconductor stripper product, demonstrating its technological competitiveness. The stripper supplied to Amkor Technology has been customized and optimized for its new production lines, reducing the process time required to remove photoresist and process residues by approximately 50% compared to existing products, significantly improving manufacturing efficiency.
As artificial intelligence (AI) investments and high-bandwidth memory (HBM) demand drive the expansion of advanced semiconductor packaging technologies, the demand for advanced process materials continues to grow. LG Chem CEO Kim Dong Choon stated that through the partnership with Amkor Technology, the company will further enhance its competitiveness by providing customized materials optimized for customer manufacturing processes.
Earlier this year, LG Chem announced a strategy to more than double the size of its electronic materials business. As part of this plan, the company is expanding its semiconductor packaging materials portfolio—including copper-clad laminates (CCL), die attach films (DAF), and photosensitive dielectric materials (PID)—while accelerating the growth of its high-value-added electronic materials business.
