A research team at Pohang University of Science and Technology (POSTECH) has developed an innovative dry adhesion technology that efficiently bonds and detaches microelectronic components and various common materials. The research, led by Professor Seok Kim, includes collaborators Professor Kihun Kim from POSTECH, Professor Namjoong Kim from Gachon University, Professor Haneol Lee from Jeonbuk National University, and Dr. Chang-Hee Son from the University of Connecticut, USA. The findings were published in Nature Communications.

This technology addresses a critical challenge in Micro-LED manufacturing—high-precision chip transfer. Traditional methods rely on liquid adhesives or specialized films, which suffer from complex processes, insufficient alignment accuracy, and residual contamination issues. The research team overcame these challenges using shape memory polymers (SMP). The SMP surface features densely arranged nanotips, which become smooth upon heating and pressing, significantly enhancing adhesion. When heated again, the surface reverts to a rough state, facilitating easy detachment.

Experiments demonstrated that this technology achieves an adhesion strength exceeding 15 atmospheres, with a detachment force close to zero, resulting in an adhesion difference of over 1,000 times between on and off states. The team successfully demonstrated precise pickup and placement of Micro-LED chips using a robotic system and verified stability on materials such as paper and fabric.

Professor Seok Kim stated, "This technology enables precise manipulation without adhesives, holding immense potential in display and semiconductor manufacturing, and is expected to drive a transformation in smart manufacturing."