HPDC Cell Technology

Battery front/back sides adopt different passivation technologies, more effectively reducing carrier recombination and enhancing power generation capability

High Reliability

A+ grade monocrystalline silicon wafer, low LID characteristics

SMBB technology, reducing microcrack risk

High-reliability welding process

Ultra-high Bifaciality

Higher rear-side power generation gain

Bifaciality 80±5%

Temperature coefficient -0.28%/℃