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Pure Copper Plate

Negotiable

Chinalco Luoyang Copper Processing Co., Ltd.

Located Region:

China

Address:

No.50 Jianshe Road, Luoyang City, Henan Province, China

Biz Consulting:

0379-64939374

E-mail:

Online Contact

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Typical Applications: Power, metallurgical equipment, water conservancy projects, new energy, electronic components, etc.

Grade	Type	Temper	Specification (mm)			Main Characteristics or Performance Parameters
Grade	Type	Temper	Thickness	Width	Length	Main Characteristics or Performance Parameters
T2 T2/ TU1 TU2 TP1 TP2 C1100 C10200 LC1011	Hot Rolled Plate	M20	4~8	600~3100	≤6000	When thickness 4~14mm, Rm≥195MPa A11.3≥30%
		M20	>8~80	200~3100	≤6000	When thickness 4~14mm, Rm≥195MPa A11.3≥30%
		R	>60~150	200~2500	≤6000	Not supplied with properties
	Cold Rolled Plate	O60, H01, H02, H04, H06	0.3~<0.5	400~610	≤2000	O60 Temper: Rm≥205MPa A11.3≥30% H01 Temper: Rm=215~295MPa A11.3≥25% H02 Temper: Rm=245~345MPa A11.3≥8% H04 Temper: Rm≥295~395MPa H06 Temper: Rm≥350MPa
			0.5~3.0	400~1020	≤3000
			>3.0~12	400~3100^⑨	≤6000
T2/	Copper Conductive Plate	M20	12~50	100~650	≤8000	High conductivity, tensile strength, hardness, bending performance according to national or industry standards, or negotiated according to user requirements
T2/	Copper Conductive Plate	O60, H02, H04	4~20	100~650	≤8000
T2	Special Pure Copper Plate	M	0.3~0.5	400~610	1000~2000	Rm≥205MPa A11.3≥42% Cupping test, grain size according to GB standard
			>0.5~3.0	400~700^⑩	450~3000
			>3.0~10	400~700^⑩	500~4000
T2A		Y	4.0~8.0	400~1000	500~4000	Rm 295~355MPa A11.3≥5%
TAg0.1A	Silver Copper Hot Rolled Plate	R	4~8	600~3100^⑨	1000~6000	When thickness 4~14mm, Rm≥195MPa A11.3≥30%
			>8~60	600~3100^⑨	1000~6000
			>60~150	600~2500	1000~4000
TU1 TU2 C10200 LC1011	Oxygen-Free Copper Plate	O60, H01, H02, H04	0.3~0.5	400~610	≤2000	O60 Temper: Rm 195~260MPa A11.3≥40% H01 Temper: Rm 215~275MPa A11.3≥30% H02 Temper: Rm 245~315MPa A11.3≥15% H04 Temper: Rm≥275MPa Conductivity and oxygen content according to national or industry standards, or negotiated according to user requirements
			>0.5~3.0	400~1020^⑪	≤3000
			>3.0~10	400~3100^⑪	≤6000
TU2 T2	Copper Plate for Cooling Wall	M20, M25	40~150	770~1590	1200~3600	Rm≥200MPa A≥30% HB≥40
TU2	Oxygen-Free Copper Plate for Cooling Wall	R	75~150	770~1590	1200~3600	Note*
LC1100	Electronic Primary Copper	Y, Y2, Y4, M	0.5~2.5	400~1000	≤3000	Note*
T2	Copper Plate for Copper Doors	Y	0.5~2.5	600~1000	≤3000	Tensile strength ≥300MPa, 90° bending without cracking