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US-based SendCutSend Secures $110 Million in Funding, Valuation Exceeds $1 Billion

US custom manufacturer SendCutSend has completed a $110 million funding round, reaching a valuation ...

2026-05-28

China's Beijing Institute of Aeronautical Materials Achieves Breakthrough in Full-Chain Single-Crystal Turbine Blade Technology

The AECC Beijing Institute of Aeronautical Materials has made significant progress in the field of s...

2026-05-26

Material Forming Equipment Committee Established in Tianjin, China, Focusing on Lightweight Technology in 2026

Recently, the inaugural meeting of the Material Forming and Equipment Working Committee and the Semi...

2026-05-26

2027 International Forgemasters Meeting to Be Held in China for the First Time

The 23rd International Forgemasters Meeting (IFM) will be held in China in September 2027, marking t...

2026-05-26

Swiss EPFL Team Achieves Holographic Volumetric 3D Printing with 70-Fold Energy Efficiency Improvement

A research team from the Swiss Federal Institute of Technology Lausanne (EPFL) has introduced a volu...

2026-05-26

Liu Wei, Post-80s General Manager of China's Tongyu Heavy Industry, Resigns

Tongyu Heavy Industry Co., Ltd. recently announced that Liu Wei, the company's director, vice chairm...

2026-05-21

UK's Sheffield Forgemasters Begins Steel Structure Assembly for 13,000-Tonne Open-Die Forging Line

Sheffield Forgemasters has commenced the steel structure assembly for the UK's largest open-die forg...

2026-05-21

German Titomic Secures Cold Spray Manufacturing Contract from Lufthansa Technik

Advanced manufacturing company Titomic has received a purchase order from Lufthansa Technik AG to pr...

2026-05-20

Texarkana Aluminum Launches Four-Stand Hot Tandem Mill in Texas

Texarkana Aluminum has successfully produced the first coil on its newly installed four-stand hot ta...

2026-05-20

The Additive Manufacturing Ceramics Conference AM Ceramics 2026 will be held in Frankfurt, Germany, in October

Ceramic additive manufacturing is accelerating its implementation in aerospace, semiconductors, medi...

2026-05-19
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