● Fast delivery: Double-sided boards completed within 24 hours at the fastest; multilayer boards completed within 2-4 days at the fastest.
● Diverse product manufacturing capabilities: Blind and buried via boards, controlled impedance, high-frequency boards, backplane rigid-flex boards, embedded buried resistor/capacitor boards, planar resistor boards, and other high-end products.
● Production lines adopt intelligent equipment for production, providing dual assurance of efficiency and quality.
● Professional and fast door-to-door delivery, saving time and effort.
● Real-time monitoring of online order status via ERP system.
● Advanced equipment introduced from Germany, Belgium, Japan, Switzerland, and other countries, as well as Hong Kong and Taiwan regions.
Product Capabilities
| Item | Conventional Process Capability | Special Process Capability | |||
| Rigid Board | Rigid-Flex Board | Rigid Board | Rigid-Flex Board | ||
| Number of Layers (layers) | 1～24 | 1～16 | ≤40 | ≤22 | |
| Finished Board Thickness T (mm) | Single-sided, double-sided boards | 0.2≤T≤3.2 | 3.2＜T≤10 | ||
| Multilayer boards | 0.8≤T≤6.0 | 6.0＜T≤10 | |||
| Finished Board Thickness Tolerance (mm) | ±0.1（T≤1.0） | ±0.075（T≤1.0） | |||
| ±10%（T＞1.0） | ±8.0%（T＞1.0） | ||||
| Maximum Size (mm×mm) | Single-sided board | 550×700 | 550×1800 | 457×610 | |
| Double-sided board | 550×700 | 550×1200 | |||
| Multilayer board | 550×700 | 550×1200 | |||
| Minimum Line Width/Spacing (mil) | Inner layer | 3 / 3 | 2 / 2 | ||
| Outer layer | 4 / 4 | 2.5 / 2.5 | |||
| Minimum Hole Diameter (mm) | 0.1 | ||||
| Board Thickness to Hole Diameter Ratio | ≤13 | ≤16 | |||
| Non-soldermask Hole Tolerance (mm) | ±0.05 | ||||
| Minimum Annular Ring (mil) | Via | 4 | 3 | ||
| Component hole | 5 | 4 | |||
| Distance from Line/Hole to Board Edge (mm) | 0.30 | 0.25 | |||
| Distance from V-cut Line to Copper (mm) | 0.4 | 0.3 | |||
| Finished Copper Thickness (OZ) | Outer layer | 1～6 | ≤14 | ||
| Inner layer | 0.5～6 | ≤6 | |||
| Solder Mask (mil) | Minimum SMT spacing for capability engineering solder bridge | 8 | 7 | ||
| Legend (mil) | Minimum line width/height | 5/40 | 4/30 | ||
| Profile Tolerance (mm) | ±0.10 | ±0.05 | |||
| Warpage | ≤1.5% (without SMT) | ≤1.0% (without SMT) | |||
| ≤0.75% (with SMT) | ≤0.50% (with SMT) | ||||
| Impedance Control Range | ±10% | ||||
● Industrial Control Computer Boards
Industrial control, rigid-flex boards, backlight boards, backplane structures
● Miniaturized/Integrated
Back drilling, multifunctional integration, gold fingers, embedded capacitors, embedded resistors/inductors
● High-reliability Heat Dissipation
Metal-based, ceramic-based, embedded copper blocks, copper bars, silver paste plugging
● Microwave Type
Characteristic passive boards, multilayer microwave boards, digital-analog hybrid multilayer boards, locally laminated microwave boards
Board Material Types:
Standard FR4, modified high-TG FR4, high-performance materials (Panasonic, TUC, ITEQ, Shengyi, etc.), metal-based board materials
High-frequency materials (ROGERS, TACONIC, Guoneng, Taikun, Shengyi, Institute 46, etc.), flexible materials (DuPont, Taiflex, Xin Yang, Shengyi)
Surface Treatment:
Leaded HASL/lead-free HASL, ENIG/electroplated nickel gold, anti-oxidation, immersion tin/electroplated tin, gold plating on connectors, hard gold plating/soft gold plating, anti-oxidation, nickel palladium, immersion silver/electroplated silver
Special Processes:
Blind via boards, buried via boards; high-frequency boards; backplanes; thick copper foil boards; embedded passive component boards (buried resistors, buried capacitors), planar resistors; heat dissipation cold plates; single-sided and double-sided rigid/aluminum-based boards; blind slot boards, back-drilled boards; metal solder hole boards, metal edge-wrapped boards; mixed lamination boards, local mixed lamination; resin plugging boards; thick gold boards; selective gold plating boards; stepped boards; flush boards; flexible boards, rigid-flex boards
