Superprecision Both Head Grinding Device

Negotiable
Japan
8230 Tamashima Otoshima, Kurashiki-shi Okayama 713-8501 JAPAN
TEL+81-86-525-6281
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Product Introduction
Both Head Grinding Deviceø200 / ø300 silicon wafer from a rough grinding cut at the both sides same time, and is wide, grinding it is possible to grinding it. RITS-30High hardness Super exact main shaft forwardi......Both Head Grinding Deviceø200 / ø300 silicon wafer from a rough grinding cut at the both sides same time, and is wide, grinding it is possible to grinding it. RITS-30High hardness Super exact main shaft forwarding Clean Conserve process High throughput