Thermal conductivity: 0.8~1.6 W/m∙K
Low thermal resistance.
Reduced product weight and easy-to-install components.
Thermal conduction and buffering effects.
Thermal conductivity: 0.8~1.6 W/m∙K
Low thermal resistance.
Reduced product weight and easy-to-install components.
Thermal conduction and buffering effects.
|
Specifications |
UNITS |
ABT-SB900 |
Test Specification |
|
Color |
/ |
Grey |
Visual |
|
Thickness |
mm |
0.16~1.0 |
- |
|
Coefficient of heat conduction |
W/m∙k |
0.8~1.6 |
ASTM D5470 |
|
Hardness |
Shore C |
75 |
ASTM D2240 |
|
UL fire-resistant Grade |
/ |
94V-0,V-1,V-2 |
UL |
|
Density |
g/cm3 |
1.7~2.5 |
ASTM D792 |
|
Withstand voltage |
Kv/mm |
>3.0 |
ASTM D149 |
|
Volume impedance |
Ω∙cm |
5.0×1013 |
ASTM D257 |
|
Dielectric constant |
1MHz |
4.2 |
ASTM D150 |
|
Working temperature |
°C |
‐40~+200 |
/ |
|
Tensile Strength |
psi |
5000 |
ASTM D412 |
|
Extension rate |
% |
6.966% |
ASTM D412 |