Thermal conductive phase change materials are heat-enhanced polymer materials designed to meet the thermal conductivity and reliability requirements of high-end thermal applications. Due to the low thermal resistance of the channels, the heat dissipation performance of the heat sinks is improved, and the stability of microprocessors, memory modules, DC-DC converters, and power modules is greatly enhanced.
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Thermal conductive phase change material (PCM)
Negotiable
China
No. 136, Gaolong West Road, Gaobu Town, Dongguan City, Guangdong Province
18665163217, 13713814003
abt889@163.com
Product Introduction
Product Specifications
|
Product Name |
ABT-XB251 |
ABT-XB252 |
ABT-XB253 |
ABT-XB254 |
Test Standard |
|
Color |
Grey |
Grey |
Grey |
Grey |
Visual |
|
Thickness |
0.126mm |
0.203mm |
0.254mm |
0.305mm |
- |
|
Thickness tolerance |
±0.019MM |
±0.019MM |
±0.030MM |
±0.030MM |
- |
|
Density |
206g/cc |
- |
|||
|
Working temperature |
-25℃～125℃ |
- |
|||
|
Phase transition temperature |
50℃~60℃ |
- |
|||
|
Coefficient of thermal conductivity |
5.0W/m |
ASTM D5470 |
|||
|
Thermal impedance @ 50psi(345KPa) |
0.014℃-in²/W |
0.020℃-in²/W |
0.038℃-in²/W |
0.058℃-in²/W |
ASTM D5470 |
|
0.09℃-cm²/W |
0.13℃-cm²/W |
0.25℃-cm²/W |
0.37℃-cm²/W |
||
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