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Copper Cu Powder
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Typical Application: Suitable for manufacturing rocket engine nozzle liners, integrated circuit heat dissipation substrates, induction coils, vacuum device electrodes, precision cooling channels in molds, etc.
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Applicable Process: Selective Laser Melting SLM / Laser Powder Bed Fusion LPBF
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Chemical Composition
wt.%
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Cu
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Fe
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S
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Pb
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Sb
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O
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Other
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Bal.
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≤0.005
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≤0.005
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≤0.005
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≤0.002
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≤0.05
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≤0.1
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Physical
Properties
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Particle Size Range/μm
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Sphericity
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Apparent Density
g/cm3
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Tap Density
g/cm3
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Flowability
s/50g
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D10
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D50
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D90
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≥10
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25-35
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≤60
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≥0.9
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≥5.0
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≥5.2
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≤22
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Mechanical Properties
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Test
Temperature
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Tensile Strength/MPa
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Yield Strength/MPa
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Elongation
/% |
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Room Temperature
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≥240
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≥165
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≥30
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