lapping machine

general description : specifically designed for unique polishing, delayering and planarization applications where r&d, prototype and small volume processing is required, engis microtech systems are available in both am-15......general description : specifically designed for unique polishing, delayering and planarization applications where r&d, prototype and small volume processing is required, engis microtech systems are available in both am-15 benchtop and mpc floor-standing models. each mpc system provides the kinematics and control required to develop processes that have 6-sigma capability for material removal, flatness and surface finish generation. the menu-driven microprocessor control allows any polishing, delayering or planarization process to be fully optimized. the oscillation system provides 3-axis motion for true cmp kinematics.