wafer dicing machine

long-term stability of profile accuracy with the newly-developed "ccpc" constant cutting-point control (patent u.s.pat.) chuck can support workpieces with an external diameter of 200 mm. a compact, energy-saving machine o......long-term stability of profile accuracy with the newly-developed "ccpc" constant cutting-point control (patent u.s.pat.) chuck can support workpieces with an external diameter of 200 mm. a compact, energy-saving machine offering high-speed, high-precision operation and easy setup and loading. this small, vertical scroll milling machine is less than 1 meter wide. chuck can support workpieces with external diameters from 20 to 80 mm. t-402scy, t-400scv