en.Wedoany.com Report on Mar 27th, Recently, semiconductor and electronics manufacturing company ASMPT and its sub-brand Ouxinming officially launched the new AERO PRO wire bonder. This equipment is designed for high-density applications, featuring high speed and high precision, capable of handling ultra-fine wires as small as 0.5 mils in diameter, enabling precise and flexible bonding operations. The AERO PRO wire bonder also integrates real-time monitoring and predictive maintenance functions, which help optimize equipment performance and seamlessly integrate into smart manufacturing environments.
Technically, the AERO PRO wire bonder adopts the new patented X Power2.0 transducer technology, supporting bidirectional energy transmission in X and Y directions, which helps form uniform spherical bonds. The equipment excels in ultra-fine pitch bonding, supporting applications with 0.5 mil wires. The redesigned worktable enhances durability, speed, and precision, while the frictionless wire clamp reduces shaft wear through software calibration. The AERO PRO wire bonder offers broad compatibility, supporting high-density substrates up to 140×300 mm, and possesses hybrid wire bonding capabilities, meeting the diverse production needs of complex packaging such as System-in-Package (SiP) and Multi-Chip Modules (MCM). It is suitable for various packaging types including BGA, LGA, memory devices, and lead-type QFP.
In terms of intelligence and automation, the AERO PRO wire bonder combines intelligent data monitoring with AI settings, equipped with the AERO EYE real-time signal monitoring system, AERO Diagnostic analysis system, and AERO Predictive Maintenance module. These features help monitor production quality and equipment maintenance throughout the process, improving performance and quality control levels, thereby increasing yield and operational efficiency. The equipment also features automated adaptation capabilities, allowing seamless integration with AGV/RGV/OHT and Manufacturing Execution Systems (MES), and connection to the SKYEYE ecosystem, providing support for semiconductor smart manufacturing, optimizing process flows, and aiding decision-making.
