en.Wedoany.com Reported - TDK Corporation has launched the B25696H series of MKP DC high-frequency film capacitors, designed specifically for next-generation silicon carbide (SiC) power conversion systems as DC link components. The new products target the growing demand for low-loss, high-frequency passive components in applications such as energy storage systems, solid-state transformers, renewable energy inverters, traction drives, and industrial motor controls.
The B25696H series offers a capacitance range from 47 µF to 1280 µF, with DC voltage ratings covering 900 V to 2000 V. This series is optimized for high switching frequency topologies enabled by SiC power semiconductors, where minimizing parasitic effects is critical to maximizing efficiency and reliability.
A key feature of the series is its proprietary internal busbar architecture, which promotes uniform current distribution across the capacitor windings. According to TDK, this design achieves a self-inductance as low as 30 nH and an equivalent series resistance (ESR) as low as 0.8 mΩ at 10 kHz, while maintaining stable ESR performance up to 100 kHz.
Reduced inductance and resistance losses help limit voltage overshoot and switching-related electrical stress on SiC devices. This improves thermal performance, enhances system robustness, and supports higher operating frequencies in advanced power converter designs.
These capacitors utilize metallized polypropylene (MKP) dielectric technology and are housed in an aluminum case with a resin seal on top. They are available in 85 mm and 100 mm diameter versions, featuring M6 threaded terminals and M12 mounting studs for mechanical installation.
The series is specified to operate within a hot spot temperature range of -40°C to +85°C. TDK reports an expected service life of 100,000 hours at a +75°C hot spot temperature and rated voltage; when voltage and temperature derating are applied, the operational life may extend to 200,000 hours.
These capacitors also support ripple currents up to 91 A at 10 kHz and an ambient temperature of +60°C, making them suitable for high power density converter architectures.
To assist system designers, TDK offers the CapThermal simulation tool, which performs thermal analysis and lifetime estimation based on specific application operating conditions. This tool is designed to simplify component selection and accelerate the development of high-performance SiC-based power electronics systems.
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