en.Wedoany.com Reported - The 2026 Symposium on Co-packaged Optics Technology and Silicon Photonics Chip Industry will be held from August 11 to 12, 2026, in Suzhou, Jiangsu Province. It is hosted by China Powder Semiconductor, and co-organized by the Semiconductor Industry Development Branch of the China International Association for the Promotion of Science and Technology and China Powder Expo.

With the rapid development of artificial intelligence, cloud computing, and high-performance computing, computing power demand is growing exponentially. Traditional pluggable optical modules are approaching physical limits in bandwidth density and power consumption. Co-packaged optics (CPO) is regarded as the core path for next-generation high-speed interconnects. Combined with silicon photonics chips—a key enabling platform—it is driving the semiconductor and optoelectronics industries into a new "optoelectronic integration" phase. Industry leader NVIDIA's heavy investment has made 2026 widely recognized as the first year of large-scale commercialization of CPO.

China has accumulated R&D progress and industrial layout in silicon photonics chip design and CPO integration, but still faces multiple challenges, including insufficient core process autonomy, weak industrial chain collaboration, a shortage of high-end talent, and incomplete standards and ecosystems. This symposium aims to build a high-level exchange and cooperation platform for the upstream and downstream of the industrial chain, covering basic materials, semiconductors, optoelectronics, advanced packaging, and system applications, to promote China's independent control and innovative development in this field. The conference will cover topics such as technology frontiers and market applications, core materials, devices and chips, manufacturing processes and integration, packaging, heat dissipation and reliability, and will feature exhibitions, procurement matching, and other special activities.