Huawei Releases the World's First 3D Data Center, Joining Hands with the Industry to Build a New AIDC Paradigm
en.Wedoany.com Reported - To address the security of large-scale AI computing centers and compatibility across different generations of AI chips, Huawei has leveraged system architecture innovation to create a new-generation 3D data center. The 3D data center draws on the concept of strict separation between the "power layer" and the "production layer" in chip factories, vertically stacking the functional spaces that are traditionally deployed horizontally in data centers, forming a four-layer architecture from bottom to top: cooling layer, IT equipment layer, power supply layer, and backup power layer.
Wang Tao, Huawei's Deputy Chairman and Rotating Chairman, said: "Trillion-parameter large models and rapidly growing Token demands have placed higher requirements on AI infrastructure, and Ascend super node clusters of more than 100,000 cards will become the baseline configuration. The 3D data center supports the 'super computing factory of Ascend super node clusters' through layered decoupling and three-dimensional stacking. The 3D data center architecture released today can serve as a reference architecture for the entire industry to build super node clusters. Through open room models, standardized drawings, and solutions, Huawei is joining hands with industry partners to build an open AI infrastructure ecosystem and jointly build a solid computing foundation for the intelligent world."

Speech by Wang Tao, Huawei's Deputy Chairman and Rotating Chairman
Ren Shulu, Huawei's Senior Vice President and Standing Supervisor, delivered a keynote speech titled "Generational Leap, Paradigm Innovation, Building a New Generation of AIDC." He said: "The 3D data center has achieved a paradigm leap from 'construction site building' to 'factory prefabrication and on-site assembly.' Treating a data center as a standard product allows for mass replication, rather than building it as a customized project." He pointed out that high-density computing in the AI era poses severe challenges to traditional data centers in terms of space, power supply, and heat dissipation. Cabinet power has surged from several kilowatts and over ten kilowatts in the air-cooling era to 100 kilowatts and 200 kilowatts, and will continue to rise in the future. Extreme energy density requires AI data centers to carry out systematic paradigm innovation in power supply, heat dissipation, operations and maintenance, and delivery cycles.

Keynote speech by Ren Shulu, Huawei's Senior Vice President and Standing Supervisor
At the same time, the 3D data center offers innovative advantages such as zoned isolation and high reliability with no fault propagation, zoned heat dissipation for high efficiency and energy savings, vertical power supply and cooling with extremely short routing, standardized and prefabricated delivery through a factory productization model with electromechanical delivery time halved, as well as domain-based and authority-based management and intelligent operations and maintenance.Currently, Huawei Cloud has deployed three major cloud core hubs in Gui'an, Guizhou; Horinger, Inner Mongolia; and Wuhu, Anhui, all of which are building 3D data centers at scale to support the rapid growth of intelligent computing power and the demand for large-scale deployment.
At the event, Huawei also released the monograph "3D Data Center" and opened the "3D Data Center Preliminary Design Drawing Library." The monograph is divided into five sections: "Computing Power Transformation, DC Reconstruction, Craftsmanship, Paradigm Shift, and Value Leap," fully decoding practical experience from the original innovation intent to full lifecycle management. The open drawing library covers disciplines including architecture, structure, water supply and drainage, HVAC and power, strong current, and weak current, laying the foundation for the industry to jointly build 3D data centers.

Huawei Officially Releases the World's First 3D Data Center
Releases Monograph and Opens Drawing Library
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