China's Archimedes Semiconductor Completes First Batch Delivery of Diamond SiC Modules

en.Wedoany.com Reported - On September 22, Archimedes Semiconductor announced that its "Diamond Inside" silicon carbide molded power modules had completed the first batch of official sample order deliveries. The products have been delivered to a domestic electric aircraft customer and will enter the low-altitude aircraft power electronic control system for full-system verification. This batch of products adopts DCM packaging and uses diamond composite material baseplates. The current milestone has advanced from the previous technology prototype demonstration to customer engineering verification.

The "Diamond Inside" modules delivered this time integrate diamond composite materials directly into the interior of the silicon carbide power module, serving as the baseplate to participate in heat conduction from the chip to the heat dissipation end. Compared with solutions that externally add diamond heat sinks, this technical approach incorporates diamond materials into the module packaging structure, changing the internal heat conduction path while maintaining the basic packaging system of the power module.

This technology was first publicly demonstrated at the 4th China (Anhui) Scientific and Technological Innovation Achievement Transformation Fair held from April 26 to 28, 2026. At that time, the product exhibited by Archimedes Semiconductor was the "Diamond Inside" series 1200V ACP-3S three-level diamond power module, with diamond materials entering the module interior through heterogeneous integration. The test data disclosed by the company includes a 40% reduction in module thermal resistance, a 30% system-level weight reduction, and the use of standard packaging dimensions.

Public information shows that the thermal conductivity of diamond materials can reach over 2000 W/(m·K). Archimedes Semiconductor combines this material with SiC power device packaging, primarily targeting applications with high power density and heat dissipation requirements. This first batch of samples will first enter electric aircraft power systems, and subsequently, through customer full-system verification, further testing of the module's performance under actual power electronic control operating conditions will be conducted.

Archimedes Semiconductor's existing product system already covers SiC molded power modules. The company previously established SiC molded module production lines including DCM, TPAK, and DSC. After this customer sample delivery, the next stage of the "Diamond Inside" product will have its subsequent product introduction and mass application progress determined by the full-system test results from the aircraft customer. Currently, publicly available information has not yet disclosed the customer name, the number of samples in this batch, or the scale of subsequent mass orders.