Wafer Planarization Machinery

Wafer Planarization Machinery Lapmaster is pleased to announce the availability of CMP systems for R&D, Lab and Limited Production manufacturing levels. These are true multi-axis Planarization systems that can be used on ......Wafer Planarization Machinery Lapmaster is pleased to announce the availability of CMP systems for R&D, Lab and Limited Production manufacturing levels. These are true multi-axis Planarization systems that can be used on Semiconductor, Compound Semiconductor and MEMS/NEMS substrates. These affordable systems offer true CMP processing without a CMP system price tag. Another benefit to these systems is that they are space-efficient and thus consume only a modest level of utilities and consumables for low cost of ownership. The Lapmaster line of Limited Production CMP systems offers capabilities to process wafers from 4” to 12” in diameter. One model processes 4”-8” wafers, the other model processes 8”-12” wafers. The systems are set-up with two (2) work stations which allows the simultaneous processing of multiple wafers or processing one (1) wafer with in-situ pad conditioning taking place in the 2nd station. Operator’s control panel features a touch-screen interface and is menu-driven. The standard system has Ethernet capability which allows for off-site reporting and control. All operations on the system are completely programmable. These systems feature three (3) spindle operation (platen drive and work station drives) which are completely independent of each other, as well as being programmable. This also applies to the oscillation drives for each work station (programmable speed & stroke). Independent pressure for each work station are also programmed, as well as synchronous or asynchronous pressure-speed ramping. The innovative Lapmaster CMP systems provide the operator with quick-release/quick-change Polishing Heads (wafer blocks) as well as a quick release/change-over platen. This enables multi-step processing using various consumables such as pads, conditioning tools or slurries with little down-time, reduced consumables costs and enhanced flexibility. The overall equipment is also well-designed and accessible for maintenance purposes. This low-maintenance system features non-corrosive and low-expansion materials. As an example, the standard platen is constructed of stable Aluminum Oxide Ceramic. The operators access to the work area and overall ergonomics are excellent. The manufacturing of this equipment, design, materials and features are clean-room compliant. R&D/Limited Production CMP Systems ■4” – 12” Wafer Diameter Capacity ■Process up to two (2) wafers simultaneously or choose in-situ pad conditioning ■Compact, space-efficient systems ■True CMP processing without a CMP system price ■Can be used on Semiconductor, Compound Semiconductor (hard) and MEMS/NEMS substrate materials ■Fully programmable and independent kinematics for platen drive: Polishing head drives, polishing head pressure, polishing head oscillation & speed ■Operator’s control touch-screen interface ■Menu-driven operations software ■Non-corrosive & low-expansion material construction ■Multi-Processing: Quick-change platen & polishing heads