en.Wedoany.com Reported - Recently, in the electrolytic copper foil production workshop of the Copper Foil Branch of Jinchuan Group Tonggui Co., Ltd. in China, a roll of 8.5-micron high-quality HTE ultra-thin electronic copper foil achieved stable mass production. This marks that Jinchuan Copper Foil's process technology in the HTE copper foil field has reached the domestic advanced level, laying a solid technical foundation for entering the high-quality market.
HTE electronic copper foil is a core foundational material for high-end electronic products such as high-frequency communication and IC packaging substrates. The 8.5-micron ultra-thin specification imposes extremely high demands on production processes. At the beginning of the project, the team's primary goal was to solve the mass production challenge. Ultra-thin copper foil concentrates mechanical stress and is prone to edge tearing and foil breakage during production. Failures were frequent in the early experimental stages, with rolls of copper foil often damaged due to uneven pressure from the rubber rollers or insufficient tensile strength. The R&D team adopted a "wheel tactic," with several members working in shifts, continuously monitoring parameters such as rubber roller pressure, tension, and edge quality for a week, and repeatedly adjusting and optimizing them. After dozens of parameter adjustments and hundreds of attempts with chemical formulations, they optimized the rubber roller pressure parameters, stabilized the copper foil tension control, and improved the elongation index, ultimately reducing the foil breakage rate to an extremely low industry level.
After solving the mass production issue, the team set out to achieve core performance far exceeding international standards. Targeting the original "stepwise current deposition" technology, the team conducted systematic optimization and upgrades, precisely controlling the gradient changes in current density to enhance the physical properties of the copper foil. In the surface treatment stage, they repeatedly refined the silane coupling agent process, dynamically adjusted chemical parameters, optimized coating methods, and precisely controlled curing temperatures to strengthen interlayer bonding force and control surface roughness. Ultimately, the product's core indicators far exceeded the IPC-4562 international standard, fully meeting the stringent requirements of high-end PCB manufacturing.
After successfully overcoming the challenges of core performance and mass production, the team completed multiple rounds of process validation, repeatedly calibrating and solidifying each step and parameter of the production line to ensure stable and consistent product quality. Tests and verifications by several downstream high-end PCB manufacturers showed that the product's various indicators fully meet standards and usage requirements, with some performances exceeding expectations, making it the "preferred choice" for customers.
From laboratory-scale trials to pilot-scale optimization, and then to stable batch production, the 8.5-micron ultra-thin electronic copper foil embodies Jinchuan Tonggui's development philosophy of "innovation-driven, high-end breakthrough." In the future, Jinchuan Tonggui will continue to advance R&D and tackle challenges for high-end products such as RTF and HVLP, explore more possibilities in high-end electronic materials, support high-quality development with robust technology, and move more steadily and farther along the track of high-end electronic materials.
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