en.Wedoany.com Reported - German CADFEM APAC has signed a Memorandum of Understanding with SilTerra Malaysia Sdn. Bhd., a Malaysian semiconductor foundry and fabless design service provider, to accelerate semiconductor innovation through simulation-driven engineering.
In response to the semiconductor industry's pressure to enhance technical capabilities while shortening development cycles, reducing costs, and minimizing risks, the two parties have established a strategic cooperation framework. This framework aims to accelerate the semiconductor innovation process through simulation-driven development, enhanced design-process alignment, and advanced digital engineering methods.
This collaboration combines CADFEM APAC's expertise in multiphysics simulation, digital engineering, and predictive development frameworks with SilTerra's deep experience in semiconductor manufacturing, process development, and fabrication technologies. The goal is to build a more efficient path from concept to chip, while reducing development risks and increasing engineering confidence.
One of the key focuses of the collaboration is the development of advanced Design-Technology Co-Optimization (DTCO) and System-Technology Co-Optimization (STCO) frameworks. By integrating device, process, and design domains into a unified digital environment, the parties aim to enable early technology exploration, faster design verification, and better correlation between simulation models and manufactured devices. CADFEM APAC will contribute its multiphysics and system simulation expertise to develop predictive engineering environments capable of modeling device physics, material behavior, thermoelectric interactions, variability, and system-level performance. SilTerra will provide process insights, manufacturing expertise, and characterization data to ensure strong alignment between virtual development models and manufacturing reality.
As AI-driven computing continues to challenge the limits of bandwidth and energy efficiency, SilTerra is advancing next-generation optical interconnect technology based on a unified silicon architecture to address growing data transmission and power consumption challenges. The parties will also explore the application of Agentic AI in enhancing semiconductor development workflows, leveraging technologies such as Natural Language Processing (NLP), Retrieval-Augmented Generation (RAG), AI-assisted EDA environments, and PDK integration, aiming to streamline documentation processes, improve cross-functional collaboration, and accelerate the transition from optical circuit concepts to manufacturable SoCs and Photonic Integrated Circuits (PICs).
The parties will establish a continuous feedback framework between simulation and manufacturing to achieve faster verification, better model correlation, and stronger alignment between design intent and manufacturing outcomes. Additionally, they will explore reliability-centered engineering approaches relevant to automotive, industrial electronics, and other high-reliability applications, where understanding the thermal, electrical, and environmental impacts on semiconductor performance is increasingly important.
Beyond technology development, this strategic collaboration will extend to activities that help demonstrate practical engineering progress and contribute to the continued growth of the regional semiconductor ecosystem. Through this Memorandum of Understanding, CADFEM APAC and SilTerra reaffirm their commitment to supporting the evolving needs of the global semiconductor industry through simulation-driven engineering, design-manufacturing alignment, and accelerated technology development.
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