India Approves ₹1.64 Trillion Semiconductor Projects, Electronics Manufacturing Jumps to Third Largest Export Category
The Indian government has approved massive investments totaling ₹1.64 trillion in 12 semiconductor p...
China's Micro LED Optical Interconnect Company Nexilumen Completes Tens of Millions of Yuan in Seed Funding
Nexilumen (Shanghai) Technology Co., Ltd. recently announced the completion of tens of millions of y...
China's largest public cloud introduces Hygon C86 domestic computing power
China's largest domestic public cloud platform has partnered with Hygon Information Technology to la...
Onsemi Sells Two Chip Plants in Philippines and United States
Onsemi has agreed to sell its packaging and testing factory in Tarlac, Philippines to Taiwan's Great...
SambaNova Systems Secures $1 Billion in Funding
SambaNova Systems is regaining market attention with its DataScale system and full-stack product por...
South Korea's LG Innotek to Invest $1 Billion in Semiconductor Substrate Plant in Hai Phong, Vietnam
South Korean electronic components manufacturer LG Innotek will invest $1 billion to build a semicon...
China's Silang Technology STAR Market IPO Accepted, Plans to Raise 4.4 Billion Yuan
On July 7, the IPO application of Shanghai Silang Technology Co., Ltd. (referred to as "Silang Techn...
US AI Chip Company SambaNova Secures $1 Billion in Funding
US AI chip company SambaNova Systems has successfully secured $1 billion (approximately IDR 16 trill...
South Korean Team Proposes V-Die Side Stacking with 4x Bandwidth Improvement over HBM4
Two research teams from South Korea and Japan have proposed side-stacking solutions for DRAM chips a...
Wafer Foundry Price Hikes: Taiwan-based TSMC Raises 5-10%, Samsung Electronics Up About 15%
The pricing model of the global wafer foundry market is undergoing profound changes, with leading pl...
China's XinShiJie Initiates A-share IPO Tutoring
On July 9, Nanjing XinShiJie Microelectronics Technology Co., Ltd. (referred to as "XinShiJie") subm...
China's ChangXin Memory Technologies Plans IPO Subscription on July 16, Aiming to Raise 29.5 Billion Yuan
ChangXin Memory Technologies will open its IPO subscription on July 16, 2026, and has officially dis...
South Korea's Hanwha Vision Develops AI SoC Based on Samsung's 4nm Process
Hanwha Vision is developing the next-generation AI system-on-chip (SoC) "Wisenet 11" based on Samsun...
Rambus Launches DDR5 9600 Chipset Targeting AI Memory Bottlenecks
Rambus has launched a DDR5 9600 RDIMM chipset for AI data center servers, aiming to address the incr...
US Startup Positron in Talks to Raise $750 Million at Up to $5 Billion Valuation
AI chip startup Positron is in talks to raise approximately $750 million in two phases, with a valua...
Japan's Mitsubishi Chemical Group Explores Semiconductor Investment in India's West Bengal
Mitsubishi Chemical Group is in discussions with the government of India's West Bengal state regardi...
Samsung Electronics Mass-Produces First PCIe 6.0 Enterprise SSD
Samsung Electronics announced on July 8 that it has begun mass production of its first enterprise so...
China's National Supercomputing Internet Core Node Goes Online, Providing Over 100,000 Domestic AI Computing Cards
On July 9, the core node of the National Supercomputing Internet was officially launched. This node ...
Technische Universität Berlin Develops New Architecture to Fabricate 36-Quantum Light Source Chip
Technische Universität Berlin (TU Berlin), in collaboration with the University of Oldenburg, has de...
Shanghai Launches Bidding for 7.8 Billion Yuan High-End Packaging and Testing Project
A high-end advanced packaging and testing project with a total investment of 7.8 billion yuan has re...
Bay Area Semiconductor Conference Scheduled for October 13-16 in Shenzhen, China
The 2026 Bay Area Semiconductor Conference (WESEMiBAY Semiconductor Conference 2026) will be held fr...
China's Lingjing Zhiyuan Completes Over 100 Million Yuan in Angel Round Financing for Embodied Chip Development
Lingjing Zhiyuan announced the completion of over 100 million yuan in angel and angel+ round financi...
Allegro Launches A81415 PMIC to Simplify Brake-by-Wire System Design
Allegro MicroSystems has introduced an automotive power management IC (PMIC), model A81415, which in...
India's Semiconductor Strategy Shifts to Chip Design: ISM 2.0 Allocates 1.25 Trillion Rupees
India's semiconductor strategy is shifting its focus from manufacturing to chip design and intellect...
Swiss SEALSQ Partners with GlobalFoundries to Advance Post-Quantum Security
SEALSQ Corp has signed a strategic Memorandum of Understanding with GlobalFoundries to conduct joint...
US JEDEC Releases SPHBM4 Standard to Reduce AI Memory Costs
JEDEC (Joint Electron Device Engineering Council) has released a new specification aimed at lowering...
Swiss Photonic Chip Developer Aylight Secures €4.5 Million in Pre-Seed Funding
Swiss photonic chip developer Aylight has raised €4.5 million in pre-seed funding to accelerate the ...
Nvidia's 88-Core Vera CPU Targets AI Inference
Nvidia has launched the Vera CPU based on a new architecture, aiming to redefine the competitive lan...
Some GPU orders of China's MetaX have been scheduled into next year, with the MXC600 series shipping in large volumes
MetaX (Muxi Co., Ltd.) has received full orders for multiple domestically produced high-end GPUs and...
Germany's QuantumDiamonds Secures €91 Million to Build Testing Facility
German quantum sensing startup QuantumDiamonds has secured €76 million in non-dilutive funding and €...