EMD Electronics Opens 3,500-Square-Meter Semiconductor Materials R&D Center in the United States
On October 2, EMD Electronics opened a new semiconductor materials R&D facility in Sheboygan Falls, ...
SpaceX Plans to Raise $40 Billion to Purchase Nvidia Chips
On October 6, SpaceX is in talks with banks and investment institutions to raise approximately $40 b...
Skyworks Completes Merger with Qorvo, Expects $500 Million in Annual Cost Synergies
On October 5, U.S. semiconductor company Skyworks completed its merger transaction with Qorvo. Under...
Vanguard and NXP Consider Building a Second 12-Inch Chip Fab in Singapore
VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard and NXP Sem...
Infineon to Open New Plant in Thailand on October 1, with Investment Exceeding 48 Billion Baht
On September 27, Infineon will officially open its new semiconductor manufacturing base in Bang Bo, ...
Qualcomm Evaluates Samsung's 2nm Process for Next-Generation Mobile Chips
On September 28, Chris Patrick, Senior Vice President and General Manager of Mobile Handset Business...
Samsung Electro-Mechanics to Invest KRW 4.27 Trillion to Expand Packaging Substrate Capacity in South Korea
On September 28, Samsung Electro-Mechanics announced an investment of KRW 4.27 trillion to expand th...
France's SiPearl Delivers First Batch of Rhea1 Processors for European Exascale Supercomputer
French chip company SiPearl has delivered the first batch of Rhea1 processor samples to Bull, which ...
China's Archimedes Semiconductor Completes First Batch Delivery of Diamond SiC Modules
On September 22, Archimedes Semiconductor announced that its "Diamond Inside" silicon carbide molded...
China's Montage Technology Achieves Mass Production of DDR5 Fifth-Generation RCD Chip
On September 28, Montage Technology announced that its DDR5 fifth-generation registering clock drive...
U.S. Team Confirms Hafnium Oxide Has Intrinsic Antiferroelectricity
On September 25, a research team at the University of Nebraska–Lincoln announced that it has confirm...
GSME and Teradyne to Build Semiconductor Test Center in Silicon Valley, Operational in Q4
On September 22, GS Microelectronics U.S. (GSME) and Teradyne announced a multi-year strategic partn...
SEALSQ and WISeKey Expand the Quantum Highway Quantum-Safe Infrastructure Network
On September 22, SEALSQ and its parent company WISeKey announced that they will continue to expand t...
MediaTek Releases Its First Dimensity CX C10 Max Computing Platform Chip
On September 21, MediaTek released the Dimensity CX C10 Max, the first flagship SoC in its all-new D...
Xingyun Technology Procures 43 Sets of GPU Computing Power Services for RMB 453 Million
On September 22, Xingyun Technology Co., Ltd. announced that the company had recently signed three "...
Qualcomm Releases Two 2nm Snapdragon 8 Gen 6 Flagship Mobile Platforms
On September 22, Qualcomm Technologies unveiled two flagship mobile platforms at the 2026 Snapdragon...
Alibaba's T-Head Unveils Yitian Server CPU Roadmap, Yitian 720 and 730 to Launch in 2027
On September 22, at the 2026 Hangzhou Apsara Conference, Alibaba's T-Head publicly unveiled its Yiti...
China Shanghai Xinkewei's 1.05 Billion Yuan Integrated Circuit Materials Project Breaks Ground
The 30,500-ton-per-year integrated circuit critical process materials project of Shanghai Xinkewei M...
ChangXin Technology's Fifth-Generation DRAM Technology Platform Officially Enters Mass Production, Wafer Output Increased by Over 50%
On September 20, at the 2026 World Manufacturing Convention, ChangXin Technology announced that its ...
GlobalFoundries Awarded $375 Million to Expand Quantum Semiconductor Manufacturing Capacity
GlobalFoundries (GF) announced that it has finalized a research and development funding agreement wo...
Doosan of South Korea Invests 970 Billion Won to Expand CCL Capacity for AI
On September 17, Doosan Corporation of South Korea announced a copper-clad laminate (CCL) capacity e...
Modi: India's Semicon 2.0 Capex Expanded to $13.5 Billion
Indian Prime Minister Narendra Modi said on Thursday at the opening ceremony of Semicon India 2026 i...
Anderon Receives $1 Billion in CHIPS Funding to Advance 300 mm Quantum Wafer Foundry
On September 16, the U.S. Department of Commerce and IBM subsidiary Anderon LLC formally signed a re...
Samsung and Qualcomm Advance 2nm Foundry Cooperation, Order Scale Not Yet Determined
September 16 news: Samsung Electronics' foundry business and Qualcomm are expanding contact regardin...
Meta Plans to Deploy MTIA 450 Self-Developed AI Chip in the First Half of 2027
On September 15, Meta confirmed plans to begin deploying a new generation of self-developed AI chips...
Micron Unveils World's First 512GB DDR5 RDIMM, Mass Production in the Second Half of 2027
On September 15, Micron Technology announced that it has successfully demonstrated the world's first...
Rigetti Secures $100 Million in CHIPS Funding to Advance Superconducting Quantum Computing R&D
U.S. quantum computing company Rigetti Computing announced that its wholly owned subsidiary, Rigetti...
Analog Devices Signs $1.35 Billion Agreement to Acquire Alif Semiconductor
On September 9, Analog Devices, Inc. (ADI) signed a definitive acquisition agreement with Alif Semic...
China's 3PEAK Exhibits 800G/1.6T Optical Communication Chips at 2026 CIOE
From September 9 to 11, 2026, 3PEAK (Stock Code: 688536) exhibited multiple optical communication an...
HCLTech invests INR 1.85 billion to set up semiconductor lab in Bengaluru, India
On September 8, HCLTech inaugurated an advanced semiconductor laboratory in Bengaluru, India, with a...