China's SoftStone Computer Wins Bid for China Mobile PC Server Centralized Procurement Project, Valued at Over 1.753 Billion Yuan
SoftStone Power announced on May 19 that its subsidiary, SoftStone Computer, successfully won the bi...
Shanghai Mayor Gong Zheng: Greater Efforts to Empower the Development of Hundred-Billion-Level Core Industrial Clusters such as Integrated Circuits and Artificial Intelligence
On May 18, the "Launching the '15th Five-Year Plan'" Shanghai special press conference was held. Gon...
Japan's Fsas Technologies Releases Monaka AI Chip and Eternus EP300 All-Flash Storage, Partner Network Expands to 5,700
Fsas Technologies, a wholly owned subsidiary of Japan's Fujitsu, has released its FY2025 business re...
Malaysia's FusionAP Completes $2 Million Pre-Seed Funding Round, Led by Former Intel Executive Team to Tackle Advanced Packaging
Malaysian advanced semiconductor packaging startup FusionAP Sdn Bhd recently announced it has secure...
AMD Announces FSR 4.1 to Roll Out in Batches to RDNA3 and RDNA2 Graphics Cards Starting July 2026 and Early 2027
AMD officially announced on May 14 that its machine learning-driven image super-resolution technolog...
Seagate's HAMR Technology Drives Mass Shipments of 30TB HDDs, AI Demand Fuels Counter-Cyclical Growth in the HDD Market
Against the backdrop of a structural shift in global data storage demand, the traditional mechanical...
Kioxia Japan and Dell USA Collaborate to Launch 2U Server, Achieving 9.8PB Flash Storage Capacity
KIOXIA America, Inc. and Dell Technologies jointly announced on May 14 a 2U rack server based on the...
Canada's FABrIC Invests in Optical Interconnects, Edge AI, and Low-Power Chips
Canada's FABrIC semiconductor initiative is committing over C$10.7 million (approximately US$7.8 mil...
China's Ruijie Networks Commences Mass Production and Delivery of 400G LPO Optical Modules, with 1.6T Product Samples Expected Within the Year
Ruijie Networks' self-developed high-speed optical module product line has entered a phase of intens...
China's National Optoelectronics Innovation Center Develops Ultra-Wideband Photonic Chip, Providing Foundational Support for 6G Communications With 250 GHz Bandwidth
The ultra-wideband photonic chip independently developed by the National Optoelectronics Innovation ...
South Korea's SK Hynix Market Cap Nears Trillion Dollars, AI Demand Drives It and Samsung Electronics to Form a Chip Duopoly
South Korean memory chip maker SK Hynix saw its market capitalization reach approximately $942 billi...
Israel's Tower Semiconductor Q1 Net Profit Up 62%, Signs $1.3 Billion Silicon Photonics Contract
Israeli foundry company Tower Semiconductor announced its first quarter 2026 results on May 13, with...
China's Lenovo Group Approved as Distributor of Nvidia H200 Chips in China, with a Purchase Limit of 75,000 Units per Customer
China's Lenovo Group officially confirmed on May 14 that the company has been approved as an authori...
Microchip Launches EX-423 Vacuum Miniature Crystal Oscillator for Low-Power Critical Timing Applications
Microchip Technology officially released the EX-423 vacuum miniature crystal oscillator on May 14, a...
London-Based AI Chip Company Fractile Secures $220 Million in Series B Funding to Accelerate Inference Chip Development
To address the latency and cost bottlenecks currently constraining cutting-edge AI workloads, London...
Belgium's imec Subsidiary IC-Link Joins TSMC 3DFabric Alliance, Accelerating Global Advanced Packaging and ASIC Deployment
Belgium-based nanoelectronics research center imec announced on May 12, 2026, that its ASIC and sili...
Samsung Electronics Plans Mass Production of CXL 3.1 Memory Modules in Q4 2026
Samsung Electronics plans to deliver samples of CMM-D memory modules based on the CXL 3.1 standard t...
China's Cix Technology and Switzerland's MetaComputing Enter Strategic Cooperation to Advance Open-Source Arm Agentic Computing Ecosystem
Chinese general-purpose heterogeneous intelligent CPU chip company Cix Technology and Swiss modular ...
Oxford Instruments USA Partners with NYU to Install First Quantum ALD System
Oxford Instruments USA and the NYU Nanofabrication Cleanroom announced a partnership on May 12, 2026...
Swiss Lightium Selects Aras Innovator PLM Platform to Develop AI Photonic Integrated Circuits
Swiss startup Lightium has selected Aras Innovator as its product lifecycle management (PLM) platfor...
Intel and NVIDIA Reaffirm Collaboration, Plan to Develop New Integrated Graphics and Processor Products
Intel CEO Lip-Bu Tan awarded NVIDIA CEO Jensen Huang an honorary Doctor of Science and Technology de...
China's Fudan Microelectronics, Fudan University, and Shanghai Guosheng Investment Jointly Build Integrated Circuit Technology Center
On May 11, 2026, Shanghai Fudan Microelectronics Group Co., Ltd. announced that it has signed a Phas...
Professor Liu Chao's Team From Shandong University, China, Has Made New Progress in the Field of Micro-LED Displays
Recently, Professor Liu Chao's team from the School of Integrated Circuits at Shandong University ma...