EU to Launch Cloud Services and Chip Localization Plan on June 3, Shifting Public Procurement Toward Technology Sovereignty Screening
The European Commission plans to unveil a package of technology sovereignty measures on June 3, focu...
Tata Semiconductor Plant in Assam, India, to Start Production This Fiscal Year with INR 270 Billion Investment
After a meeting with Assam Chief Minister Himanta Biswa Sarma, Union Minister of Information and Bro...
Keysight Technologies Launches Executable RF Design Whiteboard Software to Address Talent Gap
Keysight Technologies, Inc. (NYSE: KEYS) announced a new executable RF design whiteboard feature for...
ASRock of Taiwan, China Launches 12GB RX 9070 GRE Graphics Card, Intensifying Competition in RDNA 4 Mid-Range GPUs
On June 1, ASRock Technology of Taiwan, China, launched the ASRock AMD Radeon RX 9070 GRE Steel Lege...
South Korea's semiconductor exports surged 169% year-on-year on June 1, driving gains in Asian stock markets.
South Korea's semiconductor exports surged 169% year-on-year, a figure that drove broad gains in Asi...
Dell Launches PowerStore Elite with 5.8PB Capacity
Dell has launched its next-generation all-flash storage platform, PowerStore Elite, which delivers u...
Qualcomm Unveils Dragonfly, Its Future Server Processor Brand
On June 1, Qualcomm showcased its future data center brand, Dragonfly, during the COMPUTEX 2026 Taip...
Indium Corporation to Showcase AuLTRA Die Attach Solutions at 2026 US Exhibition
Indium Corporation will highlight its high-reliability, gold-based precision chip attach preforms at...
Cadence Launches Level 5 Autonomous Chip AI Agent at Computex 2026
At Computex 2026, Cadence introduced the industry's first fully autonomous virtual agent AI design e...
Siemens and Samsung Expand Foundry Design Collaboration
Siemens and Samsung Foundry are expanding their collaboration to provide comprehensive support for f...
China's Huawei mass-produces 381 chips based on Tau Scaling Law
Huawei has proposed a solution to the physical limits of Moore's Law, known as the Tau Scaling Law. ...
Intel Previews "Crescent Island" Chip for 2026, Featuring 480GB Memory
On June 1, Intel further disclosed details of its next-generation data center GPU, Crescent Island, ...
NVIDIA Vera BlueField-4 STX to Launch in H2 2026, 800Gb/s Security Execution Targets Agentic AI Data Channels
On May 31, NVIDIA announced new NVIDIA DOCA security capabilities for the Vera BlueField-4 STX durin...
140 UK Data Centres Queue for Grid Connection; Photonics Could Cut Power Consumption by 90%
Mark Rushworth, founder and CEO of UK-based all-optical network switch company Finchetto, holds a ce...
China's Tin Prices Surge 40% in Six Months, AI Advanced Packaging Drives Demand for "Computing Metal"
Tin prices in the Chinese market have recently remained at historical highs, rising from approximate...
India's Odisha Introduces Intel and 3DGS, $3.3 Billion Glass Substrate Project Fills Advanced Packaging Chain Gap
India's Odisha recently signed a memorandum of understanding with US-based Intel and US-based 3D Gla...
Japan's Rapidus Accelerates 2nm and Advanced Packaging with AI Foundry
The semiconductor industry is facing multiple shocks from surging demand, geopolitical shifts, and t...
Broadcom Launches Three Wi-Fi 8 Chips, Supporting Multi-Gigabit Mesh Routers
PALO ALTO, Calif., May 27, 2026 — Broadcom Inc. announced the expansion of its Wi-Fi 8 product portf...
South Korea's FuriosaAI Collaborates with Broadcom to Develop Third-Generation Chiplet AI Inference Platform
FuriosaAI announced a strategic partnership with Broadcom to jointly develop a third-generation AI a...
Synopsys Reports Q2 Fiscal 2026 Revenue of $2.276 Billion, Up 41.9% Year-over-Year
Synopsys announced revenue of $2.276 billion for the second quarter of fiscal 2026, a 41.9% increase...
Flinders University in Australia Joins Forces with Khalifa University in the UAE; Machine Learning Platform Accelerates Discovery of Gallium-Based Semiconductors
Recently, an international research team led by Flinders University in Australia, with the participa...
Huawei Proposes the Tao (τ) Law: Exploring a New Path for Chip Evolution Through Time Scaling
On May 25, at the IEEE International Symposium on Circuits and Systems (ISCAS) 2026, He Tingbo, Boar...
ASUS from Taiwan, China, Launches Hybrid Agent AI Architecture, Reducing Inference Costs for Commercial PCs
On May 25, ASUS from Taiwan, China, announced the integration of a hybrid AI architecture into its c...
China's SmartSens and UNISOC Collaborate on MicroLED High-Speed Optical Interconnects
Recently, SmartSens announced a strategic partnership with UNISOC (Shanghai) Technologies Co., Ltd. ...
SK Hynix of South Korea Introduces iHBM Thermal Solution for Next-Generation AI Memory
On May 25, SK hynix of South Korea announced the launch of its iHBM thermal solution, which embeds i...
Princeton University's Qumus System Autonomously Manufactures Graphene and Fabricates Transistors
Princeton University and several collaborating institutions recently published a research achievemen...
German Kronos Mechatronics Wins LOPEC 2026 Startup Award, In-Mold Electronics Technology Enters Automotive Lightweight Manufacturing
Recently, German Kronos Mechatronics GmbH won the "Best Business Potential" category award at the St...
France's Macron Adds €1 Billion to Quantum Plan Funding, Europe's Quantum Computing Sovereignty Chain Enters Expansion Investment Phase
On May 22, French President Emmanuel Macron, while attending the European High-Performance Computing...
China's Bester Telecom and Others Invest 200 Million Yuan to Establish Zhixin Technology Company, as AI Computing Power Enterprises Extend into the Semiconductor Business Chain
Recently, Bester Zhixin Technology (Hainan) Co., Ltd. was established with a registered capital of 2...
Wolfspeed Launches Two 3.3kV SiC Power Module Families, Targeting Power Bottlenecks in AI Data Centers and Energy Transition
Global silicon carbide technology company Wolfspeed officially launched two new families of 3.3kV si...