en.Wedoany.com Reported - Indium Corporation will highlight its high-reliability, gold-based precision chip attach preforms at the International Microwave Symposium (IMS) held June 7–12, 2026, in Boston, Massachusetts.
AuLTRA 75 is a non-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using thick gold-plated chips, such as GaN chips for high-frequency, high-power RF power amplifier devices used in 5G and other critical military and aerospace wireless communications. This product helps enhance the operational performance of these key technologies by adjusting the final solder joint composition and improving wetting and voiding rates. The AuLTRA product line also offers 78Au/22Sn and 79Au/21Sn compositions.
AuLTRA DA0001 delivers optimal performance in critical, high-reliability die attach applications, featuring high-precision thickness control, precise edge quality, optimized cleanliness, default waffle packaging, and compatibility with gold-based alloys.
Indium Corporation will also showcase the following gold-based die attach solutions: AuLTRA ThInFORMS are 80Au/20Sn preforms with a thickness of 0.00035 inches (0.00889 mm or 8.89 microns), improving overall operational efficiency of high-output lasers and helping address common issues such as short circuits and poor heat transfer. AuLTRA Fine Ribbon is the company's Indalloy 182 fine-grade precision ribbon, used in high-volume, fully automated laser diode assembly processes, where its precision, high quality, and long continuous lengths help minimize production downtime, promoting efficient, high-throughput processes that result in high-quality end products and lower total cost of ownership. AuLTRA 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste optimized to handle the high processing temperatures of gold-based alloys, suitable for high-power LED module array assemblies, ensuring consistent and repeatable printing performance with long stencil life and excellent tackiness. In addition to consistently meeting printing and reflow requirements, AuLTRA 3.2 offers excellent wetting and low voiding rates. AuLTRA 5.1 is a no-clean AuSn solder paste specifically formulated to withstand the higher temperatures required for gold-based alloys, suitable for high-power LED module array assemblies, providing a wide process window and consistent print definition, even for ultra-fine pitches. Furthermore, AuLTRA 5.1 excels in wetting performance and void minimization while meeting stringent printing and reflow standards.
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