en.Wedoany.com Reported - Global silicon carbide technology company Wolfspeed officially launched two new families of 3.3kV silicon carbide (SiC) power modules on May 21, Eastern Time, aiming to address the power bottlenecks caused by AI data centers and the global energy transition at the power infrastructure level. Both families utilize industry-standard packaging and cover the entire energy lifecycle from generation, storage, and conversion to transmission and distribution.
The first module is a high-power half-bridge module with a baseplate, built on Wolfspeed's LM platform. It is optimized for applications exceeding 800 amps, primarily targeting high-demand converter topologies for solar, grid-scale energy storage, and wind power infrastructure. The second is a scalable full-bridge module without a baseplate, a member of the Wolfspeed WolfPACK family. It offers the flexibility to configure multi-level, series-stacked, or parallel converter architectures and is specifically optimized for solid-state transformers and modular renewable energy infrastructure.
The two new modules enable design engineers to reduce the number of power stages and transition to two-level topologies suitable for DC-link architectures of 2kV and above. The products utilize Wolfspeed's fourth-generation technology, featuring enhanced cosmic ray robustness, and are focused on meeting reliability requirements in 24/7 continuous operation environments. The WolfPACK module employs advanced sintered die-attach and epoxy resin encapsulation materials, delivering power cycling performance far exceeding traditional silicone gel encapsulated modules. The baseplate module enhances system durability through advanced packaging technology featuring sintered die-attach and a copper topside system.
Guy Moxey, Vice President of Wolfspeed's Industrial and Energy Business, stated in an official release that launching this 3.3kV MOSFET voltage node with two complementary packaging formats is a strategic decision. He emphasized that the company understands the urgency customers face when scaling power infrastructure. These two families can simultaneously enable established grid-scale players and emerging participants adopting modular architectures to act quickly. The industry can only successfully meet the surging demand for power and unlock the full potential of AI and electrification by working together.
Brian Dow, CEO of medium-voltage solid-state transformer manufacturer Amperesand, pointed out that the company focuses on critical power delivery from medium voltage to the AI rack, requiring best-in-class reliability, power density, efficiency, and cost-effectiveness. The latest advancements in silicon carbide technology provide maximum reliability for the highly variable loads of AI factories, while delivering unprecedented cost-effectiveness and industry-leading power density and efficiency through optimized packaging.
Headquartered in Durham, North Carolina, USA, Wolfspeed has been a technology pioneer in the wide-bandgap semiconductor field since its founding in 1987. Its silicon carbide and gallium nitride materials and devices serve key sectors including electric vehicles, fast charging, 5G, renewable energy, aerospace, and defense. As the computing power density of AI data centers continues to climb and the global energy system accelerates its shift towards renewable energy, the 3.3kV SiC power modules launched by Wolfspeed this time are attempting to provide a clear bottom-level upgrade path for this transformation from the physical device level. The company will showcase these two new module families live at Booth 7-435 during PCIM Europe 2026, taking place from June 9 to 11, 2026, in Nuremberg, Germany.
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