en.Wedoany.com Reported - PALO ALTO, Calif., May 27, 2026 — Broadcom Inc. announced the expansion of its Wi-Fi 8 product portfolio with the introduction of three highly integrated system-on-a-chip (SoC) devices: the BCM6772, BCM6774, and BCM6776. These solutions are designed for the high-performance Ethernet router and Mesh network markets, integrating multi-gigabit performance into compact, energy-efficient form factors to serve next-generation home connectivity needs.
Prior to this, Broadcom had already announced multiple Wi-Fi 8 products, primarily modular multi-chip architectures targeting professional broadband gateways and enterprise-grade access points. The broader transition of the router market to Wi-Fi 8 requires a more streamlined approach. The new SoCs address this by integrating the application processor, network processor, 2.4 GHz and 5 GHz Wi-Fi 8 radios, and multi-gigabit Ethernet PHYs onto a single chip. This integration is crucial for both high-performance Mesh systems and multi-gigabit Ethernet routers: in the former, reducing the number of physical components and heat dissipation allows manufacturers to design smaller, more aesthetically pleasing Mesh nodes; in the latter, native support for multi-gigabit WAN and LAN interfaces makes it the ideal engine for routers handling fiber-to-the-home speeds. Mark Gonikberg, senior vice president and general manager of Broadcom's Wireless and Broadband Communications Division, stated that the company is not just shipping chips, but providing a blueprint for the next-generation connected home. By compressing complex multi-chip architectures into a single energy-efficient SoC, they enable partners to deliver more affordable, reliable, and easier-to-deploy multi-gigabit Wi-Fi 8 Mesh systems.
Across all three new SoCs, Broadcom introduces shared innovations to maximize performance and minimize complexity. Each chip includes a high-performance quad-core CPU complex and a dedicated network processing engine to offload intensive networking tasks. The BCM677x series features on-chip 2.4 GHz power amplifiers and third-generation digital pre-distortion technology, designed to reduce bill-of-materials costs and achieve lower power consumption in the 5 GHz band. Regarding specific models, the BCM6772 integrates 2×2 2.4 GHz and 2×2 5 GHz radios in an ultra-compact 15×15 mm FCBGA package; the BCM6774 integrates 2×2 2.4 GHz and 4×4 5 GHz radios, also in a 15×15 mm FCBGA package; and the BCM6776 integrates 2×2 2.4 GHz and 4×4 5 GHz radios, equipped with dual PCIe Gen3 controllers, in a compact 19×19 mm FCBGA package.
Broadcom is currently sampling the BCM677x series to its early partners and customers.
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