Huawei Launches Full-Stack AI DC Data Infrastructure Solution, CMS Reduces First-Token Latency by 90% to Accelerate Agent Business Inference Deployment
On May 21, 2026, at the Huawei Innovative Data Infrastructure Forum held in Paris, Yuan Yuan, Vice P...
Georgia Tech's New NAND Flash Memory Boosts Radiation Tolerance by 30 Times
Researchers at the Georgia Institute of Technology have developed a new type of NAND flash memory th...
Xiaomi Announces 200 Billion RMB R&D Investment Over Five Years to Boost Chip and AI Development
Following the launch event for the new YU7 GT on May 21, 2026, Xiaomi Group China revealed that the ...
Asahi Kasei Develops Photosensitive Polyimide Film for Panel-Level Packaging, Filling a Gap in the Advanced Packaging Material Chain for AI Chips
Asahi Kasei announced on May 21 that it has developed a new photosensitive polyimide film for advanc...
China's National Development and Reform Commission Guides Chinese Large Models to Adapt to Chinese Computing Power Chips, Software-Hardware Collaboration Enters a Critical Phase for Security and Controllability
China's National Development and Reform Commission (NDRC) has incorporated the adaptation of Chinese...
The Russian Academy of Sciences Has Achieved a Breakthrough in 6.7-Nanometer Gas Cluster Lithography Technology, With the Theoretical Process Potentially Reaching 1 Nanometer
The Institute of Applied Physics of the Russian Academy of Sciences, in collaboration with specializ...
China's Alibaba Designs AI Chips Around AI Agents
Alibaba, through its semiconductor subsidiary T-Head, has launched a new generation AI processor, th...
AMD Launches Nine Ryzen Pro 9000 Series Processors, Extending 3D V-Cache Technology to the Professional Sector
AMD has launched the Ryzen Pro 9000 series, a lineup of nine processors designed for professional de...
Nvidia CFO Confirms Rubin Chip Shipments in Second Half of Year, Reaffirms Confidence in Trillion-Dollar Revenue Target
Nvidia announced its first-quarter fiscal earnings after the market closed on May 20 local time. Dur...
AMD Announces Mass Production of 6th Gen EPYC "Venice" Processors on TSMC 2nm Process, 256 Cores Targeting AI Infrastructure
Advanced Micro Devices (AMD) officially announced on May 21 that its 6th generation AMD EPYC process...
The 10th Anniversary of China's JW Insights Conference Lands in Shanghai Zhangjiang, Semiconductor Exhibition Expands by 50% to Cover the Entire Industry Chain
Hosted by the Semiconductor Investment Alliance and the ICT Intellectual Property Development Allian...
China's Firefly RISC-V Rack Server Launched: 384-Core RISC-V Chip
Chinese brand Firefly has officially launched a 42U rack-mount RISC-V server, the CSC2-N48SPK3, on i...
Asahi Kasei Microdevices to Debut AK491x Series High-End Audio Operational Amplifiers at HIGH END Vienna 2026
Asahi Kasei Microdevices Corporation (AKM), an electronic components business unit of Asahi Kasei Co...
Ben Chuan Intelligent in China Starts Small-Batch Supply of 800G Optical Module PCBs, with 6 Customers Completing Prototyping
Ben Chuan Intelligent disclosed in its investor relations activity record announcement on May 19 tha...
China's Lenovo Moto Razr Fold Large Foldable Phone Released, Featuring Tianxi AI 4.0 and Snapdragon 8 Gen5 Chip
On the evening of May 19, Lenovo officially launched its first horizontal large foldable screen phon...
TSMC of China Announces CoWoS Advanced Packaging Yield Exceeds 98%, 5.5x Reticle Size Products Now in Mass Production
Taiwan Semiconductor Manufacturing Company Limited (TSMC) held its 2026 Taiwan Technology Forum in H...
AI Inference Computing Power of Top Five North American Cloud Service Providers Expected to Grow 122% Year-on-Year; NVIDIA GB and Vera Rubin Rack-Scale Deployments Accelerate
Leading North American cloud service providers (CSPs) are accelerating the expansion of AI infrastru...
China's SMIC, Huahong Group, and others jointly establish Shanghai Electronic Materials International Supply Chain Center with a registered capital of 200 million yuan
Core enterprises in China's semiconductor industry chain are accelerating their extension into upstr...
China's Qianxun Intelligence and D-Robotics Reach Strategic Cooperation, Open-Source Spirit v1.5 Model Achieves Deep Adaptation with Sunrise S600 Chip
On May 20, Qianxun Intelligence and D-Robotics officially announced a strategic cooperation. Both pa...
Alibaba's T-Head in China Releases AI Chip Zhenwu M890, Performance Triples Compared to Predecessor
Alibaba's semiconductor company T-Head officially launched its new generation training-inference int...
Alibaba's T-Head Zhenwu AI Chip Cumulative Shipments Exceed 560,000 Units, Annualized Revenue Surpasses 10 Billion Yuan
At the 2026 Alibaba Cloud Summit held on May 20, Alibaba's semiconductor company T-Head comprehensiv...
NVIDIA Delivers First Vera CPUs to Anthropic, OpenAI, xAI, and Oracle, Building Next-Generation Compute Foundation for Agentic AI
NVIDIA officially announced on May 19 local time that the first systems featuring its Vera CPU, the ...
Canada's QeM and Taiwan's JMEM TEK Sign Agreement to Develop Hardware Root of Trust System-on-Chip
Quantum eMotion Corp. (QeM) has signed an international project consortium agreement with Taiwan-bas...
University of Tokyo Team Develops Ultra-Fast, Low-Power Switching Technology
A research team at the University of Tokyo has achieved rapid rewriting and switching of magnetic st...
MIT Develops Microchip Resistant to Quantum Attacks, Providing Post-Quantum Security for Wireless Biomedical Devices
A research team at the Massachusetts Institute of Technology (MIT) has successfully developed an ult...
The Ocampo Family of the United States Establishes a $100 Million Fund to Specifically Support University Research in RF, Microwave, and Photonics Engineering
Susan Ocampo, co-founder of compound semiconductor investment firm GaAs Labs LLC, officially announc...
Nationz Technologies and Arm Technology (China) Sign Arm Total Access License, Further Expanding MCU Chip Deployment in the AI Era
Nationz Technologies Inc. and Arm Technology (China) Co., Ltd. jointly announced the signing of a mu...
China's Click Technology Invests 370 Million Mexican Pesos to Build Electronics Manufacturing Plant in Torreón, Coahuila
Shenzhen Click Technology Co., Ltd. announced it will invest approximately 370 million Mexican pesos...
China's Goworld (Jiangsu) $150 Million Optical Module and High-Density Interconnect Board R&D and Manufacturing Base Settles in Xishan, Wuxi
On May 18, China Goworld (Jiangsu) Electronic Technology Co., Ltd., a subsidiary of Singapore's Gowo...
Ren Hongbin, Chairman of the China Council for the Promotion of International Trade (CCPIT), Meets with AMD's Lisa Su; Computing Power Cooperation and APEC Business Activities Take Center Stage
Ren Hongbin, Chairman of the China Council for the Promotion of International Trade (CCPIT), met wit...