en.Wedoany.com Reported - Hosted by the Semiconductor Investment Alliance and the ICT Intellectual Property Development Alliance, and organized by JW Insights, this year's conference is themed "AI Reconstructs the Future · Ecosystem Synergy for Long-Term Success." It is expected to attract over 7,000 heavyweight guests from the industry, investment institutions, government departments, and universities.
In terms of forum structure, this year's conference has been comprehensively upgraded from the previous "1+X+1" model (i.e., 1 main forum, X thematic forums, 1 semiconductor exhibition) to a "2+2+2+4+N+1" model. This means two major summits held in parallel each day, two thematic forums each day, four closed-door exchange sessions, N linked activities, and one core semiconductor exhibition.
As the core highlight of the conference, the JW Insights Semiconductor Exhibition is not only a showcase window for technology and products but also a key platform for comprehensively presenting the innovation map of China's semiconductor industry chain. The exhibition area has been expanded by 50% from before, featuring four major specialized zones: the On-Device AI Computing Power + Storage Zone, the Advanced Packaging Industry Chain Zone, the Semiconductor Materials and Process Equipment Zone, and the IC Design/IP/EDA Tools Zone, covering all key links from chip design, manufacturing, packaging and testing, to materials and equipment.
Looking at the specific exhibiting companies, the exhibition brings together leading enterprises from both domestic and international markets. In the Manufacturing, Equipment, and Materials thematic area, there are companies such as Pudong Haiwang, Microchips Semiconductor, Xin Feng Precision, Axus Semiconductor, and GigaDevice. In the EDA Tools, Chip Design, and Terminals thematic area, it has attracted well-known domestic and international companies like Rockchip, Empyrean Technology, Synopsys, Dassault Systèmes, Dosilicon, and UniVista Industrial Software. The exhibitors include both industry leaders and listed companies, as well as a group of innovative enterprises rapidly emerging in niche segments.
Gathering full-chain players from wafer materials, production equipment, chip design, packaging and testing, to terminal brands on a single platform means far more than just a display. One exhibitor representative pointed out that after years of technological breakthroughs, many links now have stable domestic substitution solutions, especially in the equipment and materials sectors that were previously "bottlenecked," where mature products can now be delivered. This confidence, born from having the entire industry chain on the same stage, not only solves the supply chain security issues for downstream terminal manufacturers, enhancing bargaining power and risk resistance, but also signals that the communication density and industry focus of the domestic consumer electronics chain, including mobile phones, are shifting towards new tracks like AI optics and foldable screen supply chains.
Centered around the entire ICT industry chain, the JW Insights Semiconductor Conference has also arranged an extremely rich agenda, covering cutting-edge fields such as AI empowerment, on-device AI, advanced packaging, EDA/IP, storage, and industrial investment. Among these, the first-ever AI Empowerment Summit, themed "Computing Power as the Foundation, Large Models for Empowerment," focuses on GPU chips, AI computing power, large model platforms, and industrial implementation applications, connecting the entire industry chain of "chip—computing power—model—scenario—manufacturing." The summit will abandon conceptual forum models and return to the essence of the industry, with all corporate speeches revolving around products, technologies, implementation cases, and industrial empowerment solutions. The 6th ICT Intellectual Property Development Alliance Annual Conference will gather IP heads and senior executives from leading companies like Huawei, OPPO, vivo, Xiaomi, and ZTE to conduct in-depth discussions on global IP governance and industrial synergy, committed to driving the transition of intellectual property from a "protection tool" to an "innovation engine."
Furthermore, the Advanced Packaging and Testing Technology Innovation Summit, held on the first day of the conference, will bring together 500 industry experts to systematically discuss key topics such as Chiplet heterogeneous integration, multi-dimensional heterogeneous integration and co-design, and advanced packaging equipment empowerment. Executives from companies like VeriSilicon, JCET, NAURA, SJ Semiconductor, and ACM Research will deliver keynote speeches.
After a decade of development, the JW Insights Conference has grown from an initial industry exchange platform into a "carnival" and "bellwether" for China's semiconductor industry. This year's conference is located in Shanghai Zhangjiang—a strategic hub for China's integrated circuit industry. Through a diversified format of "conference + exhibition + roadshow + awards + gala dinner," it will further gather global innovation resources and inject new momentum into the high-quality development of the semiconductor industry.
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