en.Wedoany.com Reported - On May 18, China Goworld (Jiangsu) Electronic Technology Co., Ltd., a subsidiary of Singapore's Goworld Group, officially signed a contract with the Xishan Economic and Technological Development Zone in Wuxi City, announcing an additional investment of approximately US$150 million to build an R&D and manufacturing base for optical modules and high-density interconnect boards. The project has a registered capital of US$50 million, is located in the Xishan Economic Development Zone, and is expected to officially commence production in 2028. Wuxi Mayor Jiang Feng met with Goworld Group Chairman Chen Yingyi and his delegation, and jointly witnessed the signing.
Counting from its establishment in Xishan in 2003, Goworld Electronics has been rooted in Wuxi for 23 years. According to Wuxi Daily, the enterprise started with ordinary through-hole boards and gradually mastered 25-micron-level high-precision circuit boards, growing into the largest-scale, strongest-technology, and most comprehensive core production base of Singapore's Goworld Group in China, with an annual output value stable at around 2 billion yuan. In 2025, Goworld Electronics achieved an output value of 1.976 billion yuan. This additional US$150 million investment is a strategic move by the enterprise against the backdrop of full capacity utilization of existing production lines and the rapid release of orders from the AI computing power market.
The new project is not simply an expansion of production capacity; its core lies in a leap in technological hierarchy. According to the company's official introduction, the base will build mSAP (modified Semi-Additive Process) and amSAP (advanced modified Semi-Additive Process) production lines, focusing on ultra-fine circuits, minimal line width and spacing, and high-precision pad manufacturing. The finest lines can reach 20 to 25 microns, representing one of the processes with the highest technical barriers in the current PCB industry. mSAP adopts a route of thin copper layer plus pattern electroplating, pushing line width and spacing precision to below the 15-micron level. Its technical difficulties are concentrated in areas such as high-density pattern resolution, circuit electroplating thickening, and flash etching control. The products are mainly targeted at cutting-edge application fields such as high-end HDI automotive boards, optical modules, AI chip substrates, high-end GPU substrates, and ultra-fine line PCBs.
From the perspective of product line positioning, the new base focuses on two core categories: optical modules and mSAP high-precision circuit boards. Optical modules undertake the function of photoelectric signal conversion and are key core components for AI computing centers, high-speed network equipment, and high-end servers. mSAP high-precision circuit boards are specifically designed to support optical modules. In addition, AI chip substrates, as key base materials for advanced packaging, carry the electrical connections and mechanical support between the chip and the circuit board. The global AI chip substrate market is in a phase of structural expansion. The required substrate area and layer count for AI GPUs and ASICs have significantly increased, with ABF material consumption growing 5 to 10 times compared to traditional solutions, and the supply-demand gap continues to widen. Once completed and put into production, this project is expected to provide new capacity sources for the domestic market in the field of high-end packaging substrates.
Goworld (Jiangsu) Electronic Technology Co., Ltd. is a Sino-foreign joint venture controlled by Singapore's Goworld Group, recognized as a national-level specialized and sophisticated "Little Giant" enterprise and a potential unicorn enterprise in Jiangsu Province. Founded in 1988, Singapore's Goworld Group is a key player and global supplier in the printed circuit board industry, operating the most advanced factories in China and having offices in the United States and Europe. Currently, Goworld Electronics has accumulated 45 invention patents, with proprietary technology accounting for over 90% of its main products. Its market share for ultra-fine line printed circuit boards ranks third nationally, and its customers include international first-tier brands such as Siemens, Schneider Electric, Emerson, and Inventec.
Wuxi is currently deeply implementing a new three-year action plan for the integrated circuit and optoelectronic integration industry. At the signing ceremony, Jiang Feng expressed the hope that Goworld Group will continue to increase its investment in Wuxi and expand cooperation space in areas such as AI computing power, high-end communications, and automotive electronic drives. Chen Yingyi responded that the enterprise will seize the development opportunities in the AI market, accelerate the pace of project construction and production, and promote its products towards the high-end value chain of global electronic manufacturing.
The Xishan Economic and Technological Development Zone is an important承载地 for the electronic information industry in the Yangtze River Delta region, having already gathered a batch of major projects such as Xiyuan Electronics and Songci New Energy, forming an integrated circuit industry chain covering chip design, manufacturing, packaging and testing, and application development. This round of capital increase and production expansion by Goworld Electronics will fill the capacity gap in Xishan for high-end packaging substrates and core components for optical modules, driving the accelerated clustering of upstream and downstream supporting enterprises.
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