en.Wedoany.com Reported - Belgium-based nanoelectronics research center imec announced on May 12, 2026, that its ASIC and silicon photonics design and manufacturing services division, IC-Link, has officially joined the TSMC Open Innovation Platform 3DFabric Alliance as a core member. Through this membership, IC-Link will gain priority access to TSMC's full suite of 3D silicon stacking and advanced packaging technologies, including SoIC, CoWoS, InFO, and SoW, providing an accelerated pathway for custom ASIC design and heterogeneous integration in high-performance computing, automotive electronics, and telecommunications infrastructure sectors.
The semiconductor industry is shifting from transistor scaling to system-level integration. With the explosive growth of AI and high-density memory applications, 2.5D and 3D packaging are no longer back-end processes but have become core innovation drivers determining chip performance and energy efficiency. By joining the 3DFabric Alliance, IC-Link gains early development support for TSMC's advanced packaging technologies, offering leading European and American clients first-mover design advantages and production readiness from die-level to wafer-level packaging.
Ozgur Gursoy, Director of ASIC Service Portfolio and Strategy at IC-Link, stated in the announcement that advanced packaging has a decisive impact on product performance, power efficiency, and time-to-market in the HPC, automotive, mobile, and telecommunications markets. As a Europe-headquartered member of the 3DFabric Alliance, IC-Link is prepared to undertake the most advanced development projects, particularly in Europe and North America. Leveraging imec's deep expertise in heterogeneous integration, customers can master advanced packaging essentials early through flexible business models, confidently addressing the design and manufacturing challenges of high-compute-power chips at their physical limits.
IC-Link's ecosystem partnership with TSMC has been deeply cultivated over more than a decade. IC-Link joined the TSMC Design Center Alliance in 2007 and the Value Chain Aggregation Alliance in 2009. This elevation to the 3DFabric Alliance solidifies imec's strategic focus on system scaling and heterogeneous integration, directly bridging the gap between early-stage frontier research and industrial application. Aveek Sarkar, Director of TSMC's Ecosystem and Alliance Management Division, responded that TSMC is collaborating with 3DFabric Alliance members to accelerate design implementation through disruptive 3D IC technology and looks forward to imec deepening its cooperation with the OIP ecosystem through this alliance.
TSMC's 3DFabric Alliance, established in 2022, brings together substrate giants from Japan, South Korea, and Taiwan, including Samsung Electro-Mechanics, Shinko Electric, Ibiden, Toppan, and Nan Ya PCB. Its membership has recently expanded to over 20 companies, including Zhen Ding Technology and Kinsus. The official inclusion of imec and IC-Link adds a critical piece to TSMC's puzzle for high-density system scaling packaging and production line synergy, paving the way for massive AI computing power.
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