Taiwan's MediaTek Board Approves $5 Billion Financing for AI Data Center Custom Chips
Taiwan-based fabless chipmaker MediaTek has announced that its board has approved a $5 billion discr...
U.S. IonQ to Complete $1.8 Billion Acquisition of SkyWater in July 2026
IonQ (NYSE: IONQ), a developer of trapped-ion quantum hardware, has received final regulatory approv...
China Jiuzhou Yigui Plans to Invest up to 630 Million Yuan in Semiconductor Laser Stealth Dicing Project
Jiuzhou Yigui announced that its wholly-owned subsidiary, Suzhou Jingxi Semiconductor Technology Co....
Registered Capital of 1 Billion Yuan! Tongfu Microelectronics Establishes a Microelectronics Company in Shenzhen!
Recently, Tongfu Microelectronics, a leading enterprise in the domestic semiconductor packaging and ...
China Structural Reform Fund Injects Capital Twice to Support "Chinese Chips": Changxin Technology Lists on STAR Market, Raising a Record 57.9 Billion Yuan
On July 27, Changxin Technology Group Co., Ltd. (stock code: 688825, referred to as "Changxin Techno...
Hangjun New Materials High-Purity Vanadium Oxide Ceramic Powder Project Signed and Settled in Feidong, Hefei, China
Feidong County, China, has signed a project agreement with Hangjun New Materials, marking the settle...
ChipON Microelectronics Showcases Multiple New Automotive-Grade Chips at 2026 China Auto Forum
ChipON Microelectronics showcased multiple new automotive-grade chips at the 2026 China Auto Forum, ...
China's Amlogic Co., Ltd. expects a 31.85% revenue increase in the first half of 2026
On July 24, 2026, China's Amlogic Co., Ltd. issued a voluntary disclosure announcement regarding its...
Samsung Electronics of South Korea applies 4nm process to HBM4 base die, aiding capacity recovery
Samsung Electronics is applying a 4-nanometer ultra-low-power process to the base die of High Bandwi...
Wistron invests $700 million to open a factory in the US to produce NVIDIA AI systems
Wistron has opened its first US manufacturing facility in Fort Worth, Texas. The 324,000-square-foot...
China's Listen AI to Release Nebula Series Edge AI Inference Chips by Year-End
Listen AI plans to release its Nebula series of edge-side large model AI inference chips by the end ...
South Korea's Samsung, SK Group, and Naver to Meet with Nvidia CEO
Samsung Electronics Chairman Lee Jae-yong, SK Group Chairman Chey Tae-won, and Naver Board Chairman ...
Samsung Electronics builds production line with 50 hybrid bonders at Pyeongtaek campus, to launch by year-end
Samsung Electronics is building a mass production line equipped with 50 sets of chip-to-wafer (D2W) ...
Samsung DRAM evolves from 1α to 1β, NAND from 176 layers to 232 layers
In the field of memory chips, DRAM and NAND Flash have adopted distinctly different technology evolu...
China's GigaDevice Invests 500 Million Yuan in Subsidiary to Boost DRAM Projects
Memory chip manufacturer GigaDevice announced on the evening of July 21 that it has decided to use 5...
South Korea's Samsung Electronics plans to build four new wafer fabs by 2030
Samsung Electronics is refining its investment plans for a large-scale semiconductor production base...
Fortinet and Intel Collaborate to Develop SP6 Network Security Processor
Fortinet has announced a collaboration with Intel to develop the Security Processor 6 (SP6), a next-...
AI Inference Demand Drives CPU Market to Potentially Exceed $220 Billion by 2030
The demand for data center inference driven by the global artificial intelligence boom is propelling...
POSTECH Develops Chip Stacking Technology with 4x Integration Density of HBM
POSTECH has developed a new chip stacking technology that can stably stack more than 10 layers of ul...
SEMI: Global Semiconductor Equipment Sales to Reach $229.5 Billion by 2028
The International Semiconductor Equipment and Materials Initiative (SEMI) has forecast that the glob...
Seoul National University Team Develops Programmable Photonic Chip for Light Speed Control
A research team from the College of Engineering at Seoul National University has developed a program...
Powertech Technology and Broadcom Jointly Invest $400 Million in Singapore for Panel-Level Packaging
Powertech Technology has announced a partnership with Broadcom to establish a joint venture in Singa...
India's Tata Electronics Chip Fab Delayed to 2028, First Phase to Use 90nm Process
The commercial production of the Dholera chip fab in Gujarat, built by India's Tata Electronics in p...
Lenovo Unveils World's First RISC-V Server at WAIC 2026, Powered by Lanxin LX500
At the World Artificial Intelligence Conference (WAIC) held in Shanghai in July 2026, Lenovo publicl...
Japan's Rapidus Partners with Cadence to Integrate AI Agents, Doubling SoC Design Efficiency
Japanese semiconductor manufacturer Rapidus Corporation has partnered with EDA giant Cadence to inte...
US Bloch Quantum Tech Hub Receives Nearly $55 Million in Funding
The U.S. Economic Development Administration (EDA) has awarded nearly $55 million to the Bloch Quant...
Siemens Acquires US-Based Precision Innovations to Enhance AI Chip Planning Capabilities
Siemens recently signed an agreement to acquire Precision Innovations Inc., a private electronic des...
South Korea's Seoul Semiconductor Plans to Establish Manufacturing Plant in India
Seoul Semiconductor, a South Korean LED and optical semiconductor company, is accelerating its expan...
South Korean semiconductor company FADU reports operating profit of 16.3 billion won in Q2
South Korean semiconductor company FADU achieved sales of 73.2 billion won and an operating profit o...
South Korea's SK Group: Advancing Global Site Selection for Plant Construction to Meet AI Demand
Chey Tae-won, Chairman of South Korea's SK Group and the Korea Chamber of Commerce and Industry (KCC...