Apple and Broadcom Sign Over $30 Billion Deal, Locking in 15 Billion Chips
On July 8, Apple Inc. announced a multi-year partnership agreement with U.S. semiconductor company B...
China's Youibot Unveils Humanoid Robot Xifeng, Secures 4,000 Unit Pre-Orders
Recently, Chinese industrial embodied intelligent robot company Youibot launched the industrial nati...
China's YMTC SSD Debuts in Lenovo ThinkBook for the First Time
Lenovo has begun adopting solid-state drives (SSDs) from Yangtze Memory Technologies Co., Ltd. (YMTC...
China's Mind Electronics Plans to Raise 1 Billion Yuan, Adding 60,000 Pieces/Month of Power Semiconductor Capacity
Mind Electronics recently released its prospectus for a 2026 targeted issuance of A-shares (draft), ...
China Huakang Medical Consortium Wins 1.956 Billion Yuan EPC Project for Jiufengshan Semiconductor Production and Manufacturing Base
On July 8, Huakang Medical announced that the consortium formed with China Construction Third Engine...
Chinese Team Develops Phase-Change Memristor Neural Chip with 2.12 ms Latency
The team led by Yang Yuchao, in collaboration with Song Zhitang's group from the Shanghai Institute ...
Germany Launches Joint R&D Project for Silicon-Based Micro LED Microdisplays
The German Federal Ministry of Education and Research (BMBF) has officially launched the microPRO jo...
China Yanshan Technology Unveils 10,000 PPI Micro LED Optical Engine
West Lake Yanshan Technology Co., Ltd. recently officially released its self-developed Micro LED mic...
Global memory market expected to surpass $1 trillion by 2027
The global semiconductor memory market is currently experiencing its steepest growth curve in histor...
China's Memory Chip Market to Reach $449.6 Billion in 2026, Up 262.9%
According to the latest data from Omdia, the growth rate of China's semiconductor memory market in 2...
China's Andecom Joint Venture Breaks Ground on High-Purity Precursor and Electronic-Grade Solvent Project, Completion Set for 2027
On July 3, the high-purity precursor and electronic-grade solvent project of Ande Tuohua (Anhui) Ele...
2026 China Shanghai Expo: Simo Microelectronics Unveils First Domestic High-Speed ADC with Power Consumption Only 1/3 of Competitors
Beijing Simo Microelectronics Co., Ltd. (Simo Microelectronics) showcased its product portfolio and ...
Intel Files Cross-Batch Memory Patent Using Back-End Transistors and UCIe Interface
Intel has proposed a new high-bandwidth memory architecture called Cross-Batch Memory (XBM) in a pat...
South Korean AI chip startup Rebellions plans to pursue an IPO in South Korea next year and advance mass production of data center inference chips.
South Korean AI chip startup Rebellions plans to pursue an initial public offering in South Korea ne...
China's DeepSeek Launches In-House AI Chip Project to Reduce Reliance on NVIDIA
Chinese AI startup DeepSeek has launched an in-house AI chip project, focusing on improving inferenc...
South Korea's HatchTech to Go Public, Accelerating Automotive Sensor IC Development
Fabless sensor integrated circuit (IC) design company HatchTech will make its debut on the KOSDAQ ma...
Youyan Silicon Acquires 60% Stake in Jinglong Semiconductor for Approximately 451 Million Yuan
Youyan Silicon announced on July 7 that the company successfully acquired a 60% equity stake in Anhu...
AMEC Completes 1.5 Billion Yuan Private Placement to Acquire Controlling Stake in Hangzhou Zhonggui
Advanced Micro-Fabrication Equipment Inc. China (AMEC) announced on July 7 that the supporting finan...
China's SGO Co. Plans to Invest 1.13 Billion Yuan in Three Major Semiconductor Material Projects
SGO Co. announced on the evening of July 7 that it plans to invest 1.13 billion yuan in three semico...
BYD Semiconductor's BMS AFE Chip Cumulative Shipments Exceed 100 Million Units
BYD Semiconductor's BMS AFE (Battery Management Analog Front-End) chip cumulative shipments have exc...
China's Silang Technology's STAR Market IPO Accepted, Plans to Raise 4.426 Billion Yuan
On July 7, Shanghai Silang Technology Co., Ltd.'s application for an IPO on the STAR Market was acce...
China's Beken Corporation Launches BK7259 with Dual PSRAM Bandwidth of 3.2GB/s
Against the backdrop of persistently tight DRAM supply, PSRAM, with its lower standby power consumpt...
China's ByteDance Plans to Complete In-House CPU Design and Mass Production by 2027
ByteDance plans to complete the design of its next-generation in-house central processing unit (CPU)...
Samsung Electronics mass-produces PM1763 SSD with sequential read speeds of 28.4GB/s
Samsung Electronics has announced the start of mass production of the PM1763, a PCIe 6.0-based enter...
Hubei Xingchen Completes Over 4 Billion Yuan Series A Financing
Hubei Xingchen Technology Co., Ltd. announced the completion of its Series A financing round, exceed...
China's Yuquan Launches 10,000-Channel 3D Nano Laser Direct Writing Lithography Machine
Hangzhou Yuquan Precision Instruments Co., Ltd. (Yuquan), in collaboration with the State Key Labora...
Russian GS Group Showcases OEM Solutions for Electronics and Industrial Products
GS Group showcased its solutions in the field of OEM production for electronics and industrial produ...
Belgium's TUSK IC Secures ESA Contract to Commercialize Ka-Band Silicon Chips
European fabless semiconductor company TUSK IC has secured an industrial commercialization contract ...
Intel Files Patent for New HBM Architecture XBM
Intel has filed a patent for a new high-speed memory architecture called Cross-Batch Memory (XBM), a...
South Korea's FuriosaAI Brings RNGD AI Accelerator to European Market
South Korean chip startup FuriosaAI is bringing its RNGD (pronounced "renegade") AI accelerator to t...