Monash University Develops Light-Driven Chip, Poised to Boost AI and Quantum Computing
A research team at Monash University has developed a novel chip that processes information using lig...
CETC Kingbase, Hygon Information, and Kylinsoft Sign Strategic Cooperation Agreement
On June 30, CETC Kingbase (Beijing) Technology Co., Ltd. (hereinafter referred to as "CETC Kingbase"...
China's Black Sesame Technologies Unveils Thousand-TOPS Chip at GSA2026 in Shanghai
On July 2, the 2026 Shanghai International Low-Carbon Smart Mobility Expo (GSA2026), themed "Technol...
China's Zhongwei Semiconductor Ships Self-Developed Memory Chips in Q2
Zhongwei Semiconductor's new memory chip products officially began shipping in the second quarter of...
US-based Qolab Secures $54.2 Million in Series B Funding to Advance Superconducting Quantum Computing
Quantum computing hardware company Qolab Inc. announced the initial closing of its Series B preferre...
Swiss CCRAFT Secures $11.3 Million to Expand Photonic Chip Foundry
CCRAFT, a Swiss company specializing in photonic chips, has recently completed a funding round and s...
Pilot Photonics in Ireland Receives €10.4 Million Grant from European Innovation Council
Pilot Photonics, an integrated photonics company headquartered in Dublin, has received an investment...
Pasqal and Aeponyx Establish PIC Packaging in Canada with Total Investment of $7.9 Million
Pasqal, an industrial neutral-atom quantum hardware manufacturer, has established a photonic integra...
SK Hynix to Invest Approximately $389.3 Billion in Yongin Cluster, South Korea
SK Hynix announced this week that it will invest an additional 100 trillion won (approximately $64 b...
Anthropic and Micron Reach Strategic Agreement to Deploy Claude for Storage Optimization
Anthropic has entered into a multi-faceted strategic agreement with U.S. memory chip manufacturer Mi...
SanDisk Launches 10th-Generation BiCS10 3D NAND Flash Samples
On July 2, local time, SanDisk announced that samples of its 10th-generation 3D NAND flash memory te...
Infineon's €5 Billion Smart Power Wafer Fab in Germany Begins Production Ahead of Schedule
On July 2, Infineon Technologies officially inaugurated its smart power wafer fab in Dresden, German...
US Anthropic Initiates Early Planning for Self-Developed AI Chips, Discusses Manufacturing Collaboration with South Korea's Samsung
On July 2, US artificial intelligence company Anthropic has initiated early work on self-developed A...
China's Dawei Technology Plans to Raise 109 Million Yuan to Advance Embedded Memory R&D and Industrialization
On July 2, China's Dawei Technology issued a prospectus for a simplified process stock issuance to s...
China's Autowell Achieves Volume Supply of AOI Inspection Equipment for Optical Modules
On July 2, Chinese intelligent equipment enterprise Autowell disclosed its investor relations activi...
Chinese IC Substrate Company Leading Semiconductor Files for Hong Kong IPO
On July 2, Leading Semiconductor Technology (Shenzhen) Co., Ltd. submitted a listing application to ...
Membrane Group India and Kurita Water Industries Form Joint Venture to Serve Semiconductor Industry
Membrane Group India and Kurita Water Industries of Japan have announced the establishment of a join...
Nvidia Abandons 4-Die Design for 2027 Rubin Ultra Accelerator
According to source SemiAnalysis, due to manufacturing execution issues, Nvidia's originally planned...
AMD Introduces Low-Power Cores for Zen 6 Processors
AMD is developing a more complex core architecture for its next-generation Zen 6 processors, with Li...
Samsung Electronics Unveils 2nm Process Roadmap, Collaborates with Korean Government to Develop On-Device AI Chips
At the SAFE Forum 2026 held at the Seoul Seocho office building, Samsung Electronics on the 1st unve...
India's HCL-Foxconn Semiconductor Facility Breaks Ground, to Produce 36 Million Chips
Indian Prime Minister Narendra Modi laid the foundation stone online for the HCL-Foxconn joint ventu...
China Basic Semiconductor Plans Hong Kong IPO on July 8 to Raise HKD 866 Million
Shenzhen Basic Semiconductor Co., Ltd. ("Basic Semiconductor") plans to list on the Main Board of th...
China's Xinwang Microelectronics Launches Automotive-Grade Three-in-One SoC, Entering Light and Rain Sensor Market
At the 2026 Munich Shanghai Electronics Show, Shanghai Xinwang Microelectronics Technology Co., Ltd....
STMicroelectronics Launches ST54M Secure Mobile Chip with Integrated Post-Quantum Cryptography
STMicroelectronics has launched the ST54M secure mobile chip, which integrates a post-quantum crypto...
Wei'an Electronics' IPO Application Accepted, Plans to Raise 1.835 Billion Yuan
Wei'an Electronics' main board IPO application was accepted by the Shanghai Stock Exchange on June 3...
onsemi Launches ARX383CS VGA Image Sensor
onsemi has introduced the ARX383CS digital CMOS image sensor, which features a 1/8-inch optical form...
SiTime Completes Acquisition of Renesas Timing Business
SiTime has completed the acquisition of Renesas Electronics' timing business, a deal initially annou...
Qualcomm Unveils High Bandwidth Compute Architecture with 133 TB/s Bandwidth, Expected to Debut in 2027
Qualcomm is re-advancing its data center strategy, leveraging its chip design expertise in low-power...
AMD to Raise Radeon Graphics Card Prices by 10% Starting July
AMD recently notified its AIB partners (Sapphire, ASUS, XFX, ASRock, etc.) that it will once again i...
French Ardian Invests in AI Inference Chip Company VSORA
On July 1, French private equity firm Ardian announced that its semiconductor investment platform, A...