en.Wedoany.com Reported - According to source SemiAnalysis, due to manufacturing execution issues, Nvidia's originally planned Rubin Ultra AI accelerator for 2027 will abandon the 4-die design in favor of a 2-die design.
A die refers to a small square cut from a circular silicon wafer through precision dicing, containing a complete integrated circuit function.
Source SemiAnalysis believes that the 4-die design faces significant engineering challenges in areas such as advanced packaging, thermal management, and memory configuration. In advanced packaging, the 4-die interconnect approach approaches the reticle limit size; in thermal management, it requires pairing with 16 HBM4E modules, significantly increasing cooling difficulty and cost.
After switching to the 2-die design, the new Rubin Ultra's performance will be halved compared to the original 4-die design, potentially reducing its competitiveness against AMD's Instinct MI500 series.
