en.Wedoany.com Reported - On July 2, the 2026 Shanghai International Low-Carbon Smart Mobility Expo (GSA2026), themed "Technology Leading, Cross-Border Innovation," opened at the National Exhibition and Convention Center (Shanghai). Black Sesame Technologies showcased its full range of core computing power products, self-developed cutting-edge algorithms, mass-production-ready cross-domain integration solutions, and core modules for embodied intelligence, presenting its full-stack technical capabilities spanning intelligent driving, cockpit-drive integration, and embodied intelligence.
Two flagship chips from Black Sesame Technologies' Huashan series were fully displayed. Among them, the Huashan A1000 chip has achieved large-scale commercial deployment, featuring a mature and complete hardware-software ecosystem. With high reliability and cost-effectiveness, it comprehensively covers mainstream scenarios such as advanced driver assistance and intelligent parking for passenger vehicles, and has been integrated into multiple mass-production models, validated through extensive real-world scenarios. The Huashan A2000 chip, designed for the next-generation physical AI and large model era, was also exhibited. This chip is specifically built for advanced intelligent driving and edge AI inference, with a single-chip computing power of up to 1000 TOPS, supporting multi-chip collaboration to meet full-scenario needs including cockpit agents, urban NOA, L3 autonomous driving, and L4 Robotaxi.
Focusing on the cockpit-drive integration trend, Black Sesame Technologies showcased the Wudang C1200 series cross-domain fusion chip and two mass-production-ready bench solutions. The Wudang C1296, as an industry benchmark mass-production chip for cockpit-drive integration, integrates four domains—cockpit, intelligent driving, body control, and gateway—into a single chip, helping automakers simplify electronic and electrical architectures, reduce R&D costs, and shorten product iteration cycles. The Wudang® C1296 cockpit-drive integration mass-production solution deployed in Dongfeng Motor vehicles was exhibited alongside the Banma Zhixing C1296 cross-domain fusion bench, demonstrating the commercial maturity and market recognition of the C1200 series.
At the expo, Black Sesame Technologies' self-developed one-stage end-to-end algorithm became a core technical highlight. This algorithm connects the entire process loop of perception, planning, and control, achieving end-to-end full-chain intelligent decision-making and adaptation to complex scenarios, effectively improving driving safety and traffic efficiency in complex road conditions, and meeting the mass-production needs of advanced intelligent driving.
Adhering to the development strategy of "Starting from the car, but not limited to the car," Black Sesame Technologies also exhibited its embodied intelligence core products, the Aura and Kalos development modules, clearly presenting a three-wheel-driven business pattern of "Intelligent Vehicles + Embodied Intelligence + Pan-AI." Leveraging its mature automotive-grade R&D and mass-production capabilities in the vehicle domain, the company extends its high-performance edge computing power to the robotics track. The Aura and Kalos modules can flexibly adapt to the perception, decision-making, and control computing needs of various robot forms, providing a lightweight, mass-producible, and highly reliable computing foundation for the industrial implementation of embodied intelligence.
