Shenzhen Unveils Three-Year Action Plan for AI Server Industry Chain: Focus on Tackling Advanced Packaging for Memory Chips, Developing Enterprise-Grade SSDs and Memory Modules
The Shenzhen Municipal Industry and Information Technology Bureau recently issued the "Shenzhen City...
Hisense Group and Shanghai Electric Sign Strategic Cooperation Agreement: Focus on Home Appliances, Energy, Automotive Parts, and Other Fields to Jointly Expand High-End Manufacturing and Green Energy Markets
On March 24, Hisense Group and Shanghai Electric Group officially signed a strategic cooperation agr...
Huagong Tech: Clear Demand Growth for 400G and 800G Optical Modules This Year, Accelerating Upgrade to 800G
On March 22, Huagong Tech stated on the interactive platform in response to investor inquiries that ...
Musk Announces Terafab Project in Austin, USA, Plans to Build World's Largest AI Chip Factory
In Austin, Texas, Elon Musk announced the Terafab project on Saturday, aimed at building the world's...
Apple CEO Cook: New Macs Set Record for First-Time Buyers, $599 MacBook Neo Becomes Top Choice for Switchers
Apple launched three new Mac models last week: the MacBook Neo, the MacBook Air with the M5 chip, an...
Qnity Electronics Partners with NVIDIA to Jointly Drive AI and Advanced Packaging Materials R&D
On March 18 local time, Qnity Electronics announced a new technical partnership with NVIDIA. The col...
Musk: Tesla's Self-Developed AI Chip AI6 May Achieve the Performance of Dual-SoC AI5 per Single Chip, Hardware-Software Co-Optimization Becomes the Core Path
On March 18 local time, Tesla CEO Elon Musk posted on a social media platform, further disclosing th...
Boston Micro Fabrication (BMF) Launches Desktop Micron-Precision 3D Printer in the US
Boston Micro Fabrication (BMF) recently launched the microArch S150 series of compact 3D printers. T...
Future Electronics in Canada Releases Q1 2026 Market Report, Rising Lead Times Highlight Semiconductor Supply Chain Recovery
Future Electronics, headquartered in Montreal, Canada, recently released its Market Conditions Repor...
NVIDIA Launches Feynman Chip, Ushering in the Era of Optical Interconnects; CPO Industry Faces Value Reassessment
Inter-chip interconnection, a core component of the global AI computing infrastructure, is undergoin...