China's Blue Arrow Electronics Acquires 60% Stake in Chengdu Xinyi for 336 Million Yuan
Blue Arrow Electronics has acquired a 60% stake in Chengdu Xinyi Technology Co., Ltd. for 336 millio...
ZUWAY Debuts New Embedded Products at 2026 Shenzhen International IoT Expo
From June 24 to 26, 2026, the Shenzhen International IoT Industry Expo was held at the Shenzhen Conv...
Japan Subsidizes Micron's Hiroshima Plant with 536 Billion Yen for Next-Gen HBM
Micron Technology has secured large-scale subsidies from the Japanese government and has abruptly co...
Samsung and Anthropic Discuss 2nm AI Chip and Advanced Packaging Collaboration
Samsung Electronics is in discussions with North American AI company Anthropic to provide manufactur...
Finnish PostScriptum invests in Finnish quantum hardware company SemiQon
PostScriptum (led by the Founder's Office of Peter Sarlin) has become a shareholder in Finnish quant...
South Korea's SK Hynix Plans $29 Billion ADR Listing on Nasdaq
South Korean memory chip company SK Hynix plans to list on Nasdaq in the form of American Depositary...
China's First Microelectronics Exceeds One Million Cumulative Shipments of Automotive SerDes Chips in 2026
Zhang Chenguang, CEO of First Microelectronics (Changzhou) Co., Ltd., delivered a speech at the 2026...
Intel Restarts Production of 13th and 14th Gen CPUs in China to Counter DDR5 Price Hikes
The sustained price increase of DDR5 memory is forcing Intel to restart production of older processo...
Lenovo Laptops in the US Market Debut with YMTC SSDs
Lenovo's ThinkBook 14 G9 IPL laptops sold in the US market are equipped with solid-state drives (SSD...
China Linkage Technology Plans to Acquire All Shares of Northstar for $10 Million
Linkage Technology announced on July 3 that it has approved its wholly-owned subsidiary, Hong Kong L...
Intel Raises Core Ultra Processor Prices by Up to 16%
Intel has quietly raised the official pricing of its Arrow Lake-S Refresh architecture Core Ultra pr...
China's Biren Technology Plans to Raise HK$7 Billion via Hong Kong Share Placement
Biren Technology announced a placement of 153 million new H-shares at HK$46.2 per share, with expect...
TSMC Q1 Revenue Up 41% as AI Drives Semiconductor Foundry Expansion
A recent report from market research firm Counterpoint reveals a structural shift in the semiconduct...
China's Kairuide Invests 80 Million Yuan in Aerospace Storage Firm Aikesa
On the evening of July 5, Kairuide Holding Co., Ltd. (hereinafter referred to as "Kairuide") announc...
TSMC's 2027 equipment investment forecast raised to $78 billion
In response to growing demand for artificial intelligence, TSMC is expected to significantly increas...
India's Semiconductor Program 2.0 Approved with $13 Billion Allocation
The Expenditure Finance Committee (EFC) of the Indian government has approved a financial allocation...
South Korea's SK Hynix Launches $29.4 Billion Nasdaq ADR Offering to Expand AI Memory Capacity
SK Hynix has launched a $29.4 billion American Depositary Receipt (ADR) listing on Nasdaq, aiming to...
Micron Begins Expansion of Hiroshima Wafer Fab in Japan, Investing $9.3 Billion in HBM
On July 4, local time, Micron Technology of the United States commenced the expansion of its wafer f...
India's Third OSAT Facility Begins Production, CG Semi Targets 300 Million Chips Annually
Indian Prime Minister Narendra Modi announced on Saturday that CG Semi has commenced commercial prod...
Intel Launches Small Die Version of Panther Lake Processor for Mid-Range Laptops
Intel has launched the Panther Lake processor with 8 CPU cores and 4 Xe iGPU cores for the mid-range...
Intel Validates 36μm EMIB-T, Marvell Custom HBM Reduces Chip Area by 60%
As transistor density scaling slows, advanced packaging has become a primary scaling path. However, ...
China's Tuojing Jianke Semiconductor Equipment Project Launches in Haining, Zhejiang
On June 30, the Haining Economic Development Zone marked another significant milestone—the official ...
China Wuhan Star Technology Advanced Packaging Pilot Line Equipment Moved In, with Total Investment of 4.58 Billion Yuan
At around 9 a.m. on June 30, amidst a light rain, a brief and efficient equipment move-in ceremony a...
China's JCET Invests 7.8 Billion Yuan in 2026 to Expand AI Advanced Packaging, Solidifying Its Global Third-Place Position
The global semiconductor packaging and testing industry is at the forefront of an industrial transfo...
Samsung Discloses HBM4E Yield Exceeds 70% and D1d Process Progress
On June 30, Samsung Electronics' Chief Technology Officer and Head of the Semiconductor Research Ins...
South Chip Technology of China Launches 22V/60A DrMOS and Dual-Channel Four-Phase Controller
Today, South Chip Technology (Stock Code: 688484) proudly announces the launch of the 22V/60A high-c...
Japan's Renesas Electronics Unveils 2035 Strategy, Aiming for Global Top Three and Focusing on AI
Future growth drivers will be divided into three phases: Artificial Intelligence Infrastructure, Phy...
China's BOE Establishes Micro LED Optical Interconnect and Glass Carrier Board CPO Project Team
On July 3, BOE released its latest investor relations activity record, detailing the latest progress...
GigaDevice Launches First GD24CL Series I²C EEPROM
GigaDevice has launched its first EEPROM product, the GD24CL series I²C EEPROM, which features high ...
Meta's upcoming MTIA chips to adopt Samsung's 2nm process
Meta's upcoming self-developed AI accelerator MTIA chips are planned to be manufactured using Samsun...