SEMI Forecasts Global Semiconductor Equipment Sales to Reach $229.5 Billion by 2028
The International Semiconductor Equipment and Materials Initiative (SEMI) announced in its Mid-Year ...
Google Pixel 11 to Adopt TSMC's 2nm Chip Ahead of iPhone 18
Google's Tensor G6 chip will be manufactured using TSMC's N2 node, marking the first time Google's s...
Spanish Government Launches Public Consultation on Future European Chips Act 2.0
The Ministry for Digital Transformation and Public Function (Ministerio para la Transformación Digit...
Samsung Electronics to Build DRAM Plant in Giheung with Monthly Capacity of 100,000 Wafers
Samsung Electronics is planning to construct a new DRAM production facility at its Giheung plant in ...
Samsung Electronics Advances Expansion of Onyang HBM Advanced Packaging Plant
Recently, Samsung Electronics has initiated the approval process for the expansion of its advanced p...
US Cerebras to Invest Billions of Euros in Expanding Data Centers in Europe
US semiconductor startup Cerebras announced on Thursday that it will invest billions of euros in Eur...
India Proposes ₹1.25 Trillion Allocation for Semiconductor Mission 2.0, Focusing on Chip Manufacturing
Whether India's long-term semiconductor strategy succeeds hinges critically on the development of th...
US and Chinese PC makers test Samsung's GAIA AI chip prototype, targeting mass production in 2027
Samsung is developing a PC-specific AI accelerator codenamed GAIA, with HP in the US and Lenovo in C...
South Korea's SK Hynix Restructures HBM Supply Chain, Establishes Three Major Bases in South Korea and the U.S.
SK Hynix will use the funds raised through its American Depositary Receipt (ADR) public offering to ...
China's Huawei Supports SwaySure in Building a DRAM Factory with 140,000 Monthly Wafer Capacity
Huawei is supporting a major DRAM manufacturing project in China, led by SwaySure Technology, a memo...
South Korea's tax revenue may exceed 500 trillion won in 2027, government establishes fund to invest in AI semiconductors and data centers
The South Korean government, based on national tax revenue expected to surpass 500 trillion won for ...
SK Hynix's First Fab in Yongin Enters Cleanroom Installation Phase
SK Hynix's first fab at the Yongin Semiconductor Cluster in South Korea has entered the installation...
Samsung Completes Design of Tesla AI5 Chip Using 2nm Process
Samsung Electronics announced the completion of the design work for Tesla's self-developed AI5 chip,...
South Korea's TLB to Build Second Semiconductor PCB Factory in Vietnam
On July 13, South Korean printed circuit board manufacturer TLB announced its Vietnam expansion plan...
UMC Singapore Fab Delivers First Batch of Mass-Produced Silicon Photonics Wafers
On July 14, Taiwan's United Microelectronics Corporation (UMC) and Singapore's SILITH jointly announ...
TSMC's Advanced Packaging Park Phase II Breaks Ground in Chiayi, Taiwan, China
On July 12, the Southern Taiwan Science Park Administration initiated the construction of the Chiayi...
Micron's New York Wafer Fab Transitions to Main Construction Phase
Recently, Micron Technology completed the first foundational concrete pour for its inaugural wafer f...
Bosch Starts Sample Production at First US Silicon Carbide Wafer Fab
On July 13, Bosch announced that its silicon carbide semiconductor plant in Roseville, California, U...
Samsung Electronics and SK Hynix Advance 16-Layer HBM4 Mass Production, Accelerating Probe Card Upgrades
Samsung Electronics and SK Hynix announced in 2026 that 16-layer stacked HBM4 has entered the mass p...
Samsung Electronics and Samsung Display advance glass interposer prototype manufacturing
Samsung Electronics and Samsung Display are jointly advancing the development of next-generation gla...
Qualcomm Introduces Near-Memory Computing HBC, Boosting Effective Bandwidth by 54x
Qualcomm recently stated in its technical blog that the key to AI performance improvement over the n...
China Hubei Xingchen Advanced Packaging Phase II Pilot Line Enters Equipment Installation and Commissioning
China Hubei Xingchen Technology Co., Ltd. has completed the arrival of the first batch of core proce...
South Korean Government Invests 1,350 Trillion Won to Advance Semiconductor and AI Mega Projects
The South Korean government has designated semiconductors, artificial intelligence (AI) data centers...
Nvidia Confirms Rubin Ultra Chip to Ship on Schedule in 2027
Nvidia's single-quarter revenue is approaching the $100 billion mark, and company management stated ...
India Advances 12 Semiconductor Projects, Accelerating Wafer Fabrication and Packaging Capacity
India's semiconductor device and component consumption is projected to grow from approximately $54 b...
Thailand accelerates construction of AI and semiconductor industry infrastructure
On July 12, the Thai government announced that it will leverage its existing electronics manufacturi...
Samsung Develops PC AI Accelerator GAIA, Mass Production Expected in 2027, Samples Provided to Lenovo and HP for Verification
Samsung Electronics is developing a new AI accelerator for personal computers, named GAIA, with samp...
Belgium's e-peas Expands Battery-Free IoT Power Management Chip Product Line
Belgian semiconductor company e-peas is accelerating the development of ambient energy harvesting po...
EU Chip Joint Venture Launches €50 Million Quantum Chip Pilot Line
The EU Chips Joint Undertaking (Chips JU) has launched Q-PLANET (Quantum Chip Stability Pilot Line),...
Intel Develops 75 TOPS Space-Grade Chip Starfire for the U.S. Government
Intel has unveiled Starfire, a space-grade system-on-a-chip designed specifically for the U.S. gover...