en.Wedoany.com Reported - At around 9 a.m. on June 30, amidst a light rain, a brief and efficient equipment move-in ceremony at Guanggu First Road, East Lake High-tech Zone in Wuhan, was completed in just over 10 minutes. On that day, Hubei Star Technology Co., Ltd. (hereinafter referred to as Star Technology) completed the move-in of the first batch of core process equipment for its pilot line, marking the transition of thisadvanced packaging pilot platform with a total investment of 4.58 billion yuan into the pre-production installation and commissioning phase.
"From pile driving to equipment move-in in nine months is rare in the history of semiconductor fab construction," said Wang Yiqun, General Manager of Star Technology, during an on-site interview with reporters. Behind this speed lies the team's extreme compression and efficient execution in project management. As planned, equipment will be delivered in batches, withfull line connectivity expected by September this year.
Headquartered in Guanggu, Star Technology is a tech enterprise specializing in advanced packaging for integrated circuits. It was incubated and established by Hubei Jiangcheng Laboratory in August 2021, undertaking the core function of commercializing the laboratory's research outcomes.
As chip manufacturing processes approach physical limits, advanced packaging has become a key track in the "post-Moore era." Star Technology's pilot platform is a significant layout by Wuhan in this track. The project includes the construction of a 9,700-square-meter high-standard cleanroom, targetinghigh-performance AI computing, smart terminals, sensing-memory-computing integration, and optoelectronic integration chips, providing "one-stop" solutions for interconnect integration pilot runs and risk mass production.
Wang Yiqun stated thatonce the production line is fully established, it can simultaneously support pilot runs and risk mass production for 40 to 50 chip types, as well as performance verification for 30 to 40 sets of domestic semiconductor equipment and materials. This will significantly accelerate the transition of high-end intelligent computing chips from R&D to mass production, speeding up the construction of China's independent system-in-package technology system. The project's annual revenue from R&D and foundry services is expected to reach2.7 billion yuan.
Looking ahead, a larger industrial ecosystem network is being woven. Star Technology will collaborate with Guanggu's AI chip and optical chip industrial bases to build a regional integrated chip industry ecosystem.The project aims to attract over 50 upstream and downstream tech enterprises to settle in Wuhan within ten years, driving the regional advanced packaging output value to exceed 50 billion yuan.
