GlobalFoundries and TSMC Sign $2 Billion Silicon Interposer Manufacturing Agreement

en.Wedoany.com Reported - On October 8, U.S. semiconductor manufacturer GlobalFoundries and TSMC signed a $2 billion silicon interposer manufacturing agreement, with an initial cooperation term of 5 years. GlobalFoundries will expand manufacturing capacity at its existing wafer fab in Malta, New York, to supply silicon interposers for TSMC's CoWoS advanced packaging system, and is expected to begin ramping up large-scale production capacity in the first half of 2028.

Under the agreement, GlobalFoundries is responsible for silicon interposer manufacturing and related capacity construction, and the new production capacity will support multiple generations of advanced packaging products. The Malta facility plans to expand its silicon interposer manufacturing scale and provide manufacturing capabilities for components including integrated deep trench capacitors (DTC). The two parties have also established a framework for subsequent capacity expansion, allowing supply scale to gradually increase according to customer demand.

The silicon interposers involved in this cooperation are mainly used in advanced packaging for artificial intelligence processors and high-bandwidth memory. TSMC's CoWoS technology integrates different chips such as processors and memory into the same packaging system through high-density interconnect structures on the silicon interposer. The silicon interposers produced by GlobalFoundries will enter TSMC's advanced packaging supply system to serve the manufacturing needs of artificial intelligence and high-performance computing chips.

GlobalFoundries plans to use its existing semiconductor manufacturing facility in Malta to establish a domestic U.S. supply capability for silicon interposers. According to the construction arrangements announced by the company, the facility is expected to become the first U.S. manufacturing source of silicon interposers for related advanced packaging technologies.