Synopsys to Halt Updates for Some Wafer Manufacturing Analysis Software, Focusing on AI Chip Design Business
On July 7, U.S. EDA software company Synopsys plans to stop providing new versions of some wafer man...
1TB SSDs Surge to 1,000 Yuan as Memory Chip Price Hikes Reach Consumers
On July 6, the impact of memory chip price increases continued to spread to consumer terminals, with...
Annual capacity targets 1 billion chips, China's AiFoGuangTong breaks through high-frequency filter chip mass production
Guangzhou AiFoGuangTong Technology Co., Ltd., a Chinese radio frequency (RF) filter chip enterprise ...
China's Baixin Invests Over 4 Billion Yuan in Guangzhou Nansha, with Annual Output Value Exceeding 10 Billion
On July 4, the Nansha Development Zone Investment Promotion Bureau of Guangzhou signed a cooperation...
Hunan Provincial Department of Industry and Information Technology Launches Survey on Industrial Control System Products and Solutions
The Hunan Provincial Department of Industry and Information Technology has recently initiated a surv...
UMC Reports Q2 2026 Revenue of NT$68.7 Billion, Up 16.97% YoY, Hitting a New High
On July 6, wafer foundry United Microelectronics Corporation (UMC) announced its consolidated revenu...
China's First 510×515mm Panel-Level Packaging Lithography Equipment by CFMEE Receives Orders
CFMEE (Chengdu Fine Microelectronics Equipment Co., Ltd.) announced that its independently developed...
China's DDR5 DRAM Modules Reach 8000MT/s, Mass Production Accelerates
Entering the second half of the year, multiple institutions predict further upside potential for ave...
China's Zhonghao Xinying Unveils Self-Developed TPU Chip "Xuyu"
Zhonghao Xinying recently officially launched its new generation of fully self-developed high-perfor...
Samsung Plans to Raise DRAM Prices by 20% in Q3
Samsung plans to increase the average selling price of general-purpose DRAM by approximately 20% com...
Semiconductor and AI software company Syntiant files IPO application with U.S. SEC
Syntiant Corp, a semiconductor and AI software company focused on the "physical AI" field, formally ...
Samsung and SK Hynix Delay Adoption of Hybrid Bonding Technology for HBM
Samsung Electronics and SK Hynix are reassessing their plans to introduce hybrid bonding technology ...
India's Assam Seeks Cooperation with Japan in Semiconductors and Clean Energy
India's Assam is seeking to play a more significant role in the India-Japan strategic partnership, w...
Apple Extends ASIC Supply Agreement with Broadcom to 2031
Apple has extended its custom application-specific integrated circuit (ASIC) supply partnership agre...
Intel Confirms CPU Price Hike in the US
Intel has confirmed a price increase for its CPU products, triggering a price hike cycle across the ...
China's Biren Technology Raises $892 Million to Boost GPU Production
Shanghai Biren Technology Co., Ltd. has raised funds by issuing new shares worth HK$7 billion (appro...
UK Distributor Anglia Signs Analog IC Distribution Agreement with 3PEAK
Analog IC distributor Anglia Components has signed a distribution agreement with 3PEAK Incorporated....
Apple and Broadcom Extend Chip Partnership to 2031
Apple and Broadcom have extended their chip supply cooperation agreement to 2031, solidifying a key ...
Micron and Ford Sign Automotive Semiconductor Supply Agreement
Micron Technology has signed a long-term agreement with Ford Motor to provide memory and storage pla...
Swiss SEALSQ Reports Approximately $11 Million in Revenue for First Half of 2026, Up 120%
SEALSQ Corp has announced its preliminary unaudited financial results for the first half of 2026, wi...
Syntiant Files Registration Statement for Proposed Initial Public Offering with the U.S. SEC
Syntiant Corp. announced that it has publicly filed a registration statement on Form S-1 with the U....
Japan's TAI Completes Prototype Verification of Sting Ray Edge Physical AI Chip
TokyoArtisan Intelligence (TAI) of Japan announced on July 6 that the design, manufacturing, testing...
U.S. Etched Completes Tape-Out of AI Inference Chip A0 and Builds First Racks
U.S. AI chip startup Etched announced that its inference accelerator chip has completed A0 step tape...
US-based Mtron Showcases eVibe Vibration-Compensated OCXO Technology with Integrated PLL at IMS 2026
Mtron Senior Vice President Paul Dechen and Sales Director Durga Devneni introduced at the IMS 2026 ...
Samsung Electro-Mechanics and Japan's Dongwoo Fine-Chem jointly invest 480 billion KRW to establish a glass core company, accelerating next-generation semiconductor packaging
Samsung Electro-Mechanics has signed a formal contract with Dongwoo Fine-Chem, a subsidiary of Japan...
SK Hynix Launches 1.4 Trillion KRW Win-Win Project Over Five Years
SK Hynix announced that it will invest 1.4 trillion KRW over the next five years to establish a "Gro...
IBM Unveils 0.7nm Chip with Nearly 100 Billion Transistors
IBM showcased a research chip using a 0.7nm manufacturing process at the 2026 VLSI Symposium, integr...
Samsung Union Proposes Tripartite Talks on 800 Trillion Won Semiconductor Plant Project in Honam, South Korea
The Samsung Electronics Chapter of the Samsung Group Supra-Enterprise Labor Union proposed on the 1s...
South Korean President Lee Jae-myung Urges Acceleration of Major Chip Projects
South Korean President Lee Jae-myung on Monday ordered officials to swiftly launch major chip and ar...
China's Meituan Open-Sources AI Model LongCat-2.0, Chip Manufacturers Achieve Synchronized Adaptation
On July 6, China's Meituan officially open-sourced all model weights, inference engine, and core tec...