en.Wedoany.com Reported - CFMEE (Chengdu Fine Microelectronics Equipment Co., Ltd.) announced that its independently developed China's first 510×515mm panel-level packaging direct-write lithography equipment, the PLP 2000, has completed technical qualification and received purchase orders from core customers in the advanced packaging field. This marks a substantial breakthrough for domestic large-panel advanced packaging lithography equipment.

In advanced packaging production lines, lithography equipment is a critical link. Previously, the market for 510×515mm large-panel direct-write lithography equipment was long dominated by overseas manufacturers, leaving Chinese packaging and testing companies and IC substrate manufacturers facing high equipment procurement and maintenance costs in building high-end production lines.

The PLP 2000 is designed for high-end IC substrates and ultra-large panel advanced packaging processes, with processing specifications tailored to the mainstream production line requirements of current AI computing chip packaging. The completion of technical qualification and receipt of orders indicate that Chinese manufacturers have gained the ability to compete with overseas products in this niche field.

Currently, the AI server and HBM advanced packaging sectors are in an expansion cycle, with concentrated investment demand for high-end substrates and ultra-large panel packaging production lines. As a core piece of packaging equipment, the order status of direct-write lithography reflects the pace of downstream capacity expansion.

CFMEE has previously disclosed that its entire production lines are operating at full capacity with a robust order backlog. The inclusion of the PLP 2000 in customer procurement lists expands the company's high-end equipment product portfolio and strengthens its position in the packaging lithography equipment field.

In terms of delivery capability, CFMEE, leveraging the coordinated production capacity of its Phase I and Phase II facilities, has prepared for the mass production and delivery schedule of the PLP 2000. This equipment can cover the entire lithography process for substrates supporting memory chips and computing chips, aligning with the expansion plans of China's leading packaging and testing companies and IC substrate manufacturers.

For downstream customers, the introduction of domestic equipment improves the controllability of procurement costs and offers more flexible maintenance response and spare parts supply. As the PLP 2000 gradually enters production lines, the pace of domestic substitution for advanced packaging equipment is expected to accelerate further.