en.Wedoany.com Reported - Suzhou Fatidi Technology's ChiNext IPO application was recently accepted by the exchange. This national-level specialized and new "Little Giant" enterprise plans to raise 1.8 billion yuan to expand high-end chip testing hardware capacity and advance cutting-edge technology R&D.

Founded in February 2014, Fatidi specializes in high-performance test sockets and packaging and testing interface components, serving as a domestic full-solution provider of consumable hardware for semiconductor packaging and testing. Its products are compatible with high-performance chip testing for GPUs, CPUs, SoCs, and others, widely used in AI computing power, high-end smart terminals, automotive electronics, and industrial control sectors, achieving domestic substitution for high-end packaging and testing consumables and breaking the long-standing monopoly of overseas manufacturers.

The 1.8 billion yuan raised will be primarily used for constructing advanced production bases, developing and manufacturing liquid cooling heat dissipation and temperature control technology for high-power chips, building headquarters and R&D centers, with the remainder supplementing daily operational liquidity. Upon project implementation, it will expand high-performance test socket capacity, tackle core technologies in liquid cooling temperature control testing for AI high-power chips, and improve R&D and industrial supporting facilities.

With the continuous expansion of the AI HPC and advanced packaging industries, demand for high-end chip testing consumables has surged, and Fatidi's existing capacity struggles to meet growing orders. The funded production base will enhance delivery capabilities, while the liquid cooling R&D project will lay out next-generation high-power chip testing solutions, solidifying its technological advantages.