en.Wedoany.com Reported - Recently, Tongfu Microelectronics, a leading enterprise in the domestic semiconductor packaging and testing field, has made another strategic move. Public information from Tianyancha and Qichacha shows that Tongfu Microelectronics (Shenzhen) Co., Ltd. has been officially established. The company is wholly owned by Tongfu Microelectronics Co., Ltd. (hereinafter referred to as "Tongfu Microelectronics"), with a registered capital of up to 1 billion yuan.

According to business registration information, the legal representative of this newly established company is Mr. Shi Lei.

Mr. Shi Lei currently serves as the Chairman and President of Tongfu Microelectronics, possessing extensive management experience in the semiconductor industry. His personal leadership of the new Shenzhen company underscores the high importance Tongfu Microelectronics places on this strategic deployment.

The business scope of the new company covers key segments of the integrated circuit industry chain, specifically including: integrated circuit design, integrated circuit manufacturing, integrated circuit sales, sales of semiconductor device specialized equipment, manufacturing of semiconductor device specialized equipment, as well as technology import and export, and goods import and export. This business scope indicates that the subsidiary will not only focus deeply on the R&D and production of semiconductor devices but also encompass the manufacturing and sales of specialized equipment, reflecting a full-chain layout approach from equipment to products.

The decision to establish a wholly-owned subsidiary in Shenzhen is seen as a critical step for Tongfu Microelectronics to deepen its presence in the South China market and get closer to end-use application scenarios. As a major hub for China's electronic information industry, Shenzhen gathers numerous system manufacturers, terminal brands, and chip design companies. By setting up a base in Shenzhen, Tongfu Microelectronics can respond more efficiently to customer needs, strengthen its synergy in integrated circuit design and manufacturing, and further improve its business landscape both domestically and globally.

As a globally leading provider of integrated circuit packaging and testing services, this move by Tongfu Microelectronics not only helps enhance its design and equipment R&D capabilities in the upstream segments of packaging and testing but also lays a solid foundation for expanding new business growth points. With the gradual implementation of this project, it is expected to positively drive the ecosystem of the integrated circuit industry chain in Shenzhen and the broader Guangdong-Hong Kong-Macao Greater Bay Area.